14-8125 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET 14POS TIN
| Part | Termination Post Length | Termination Post Length | Current Rating (Amps) | Material Flammability Rating | Operating Temperature [Min] | Operating Temperature [Max] | Pitch - Post | Pitch - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Number of Positions or Pins (Grid) | Housing Material | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Material - Mating | Mounting Type | Contact Material - Post | Pitch - Mating | Pitch - Mating | Type | Type | Type | Termination | Features | Contact Material - Post [custom] | Contact Finish - Mating | Type [custom] | Type [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 3.56 mm | 0.14 in | 1 A | UL94 V-0 | -55 C | 105 ░C | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | 14 | Polyamide (PA46) Nylon 4/6 Glass Filled | 5.08 µm | 200 µin | Tin | Phosphor Bronze | Through Hole | Phosphor Bronze | 0.1 " | 2.54 mm | 7.62 mm | 0.3 in | DIP | Solder | Closed Frame Elevated | ||||
Aries Electronics | 3.56 mm | 0.14 in | 3 A | UL94 V-0 | -55 C | 105 ░C | 0.1 in | 2.54 mm | 10 Áin | 0.25 çm | 14 | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.76 Ám | 30 Áin | Gold | Beryllium Copper | Through Hole | 0.1 " | 2.54 mm | 7.62 mm | 0.3 in | DIP | Solder | Closed Frame Elevated | Brass | Gold | |||
Aries Electronics | 3.56 mm | 0.14 in | 3 A | UL94 V-0 | -55 C | 105 ░C | 0.1 in | 2.54 mm | 10 Áin | 0.25 çm | 14 | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.76 Ám | 30 Áin | Gold | Beryllium Copper | Through Hole | 0.1 " | 2.54 mm | DIP | Solder | Closed Frame Elevated | Brass | Gold | 15.24 mm | 0.6 in |