24-4518 Series

Catalog

CONN IC DIP SOCKET 24POS GOLD

Part	Termination Post Length	Termination Post Length	Current Rating (Amps)	Material Flammability Rating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Post [custom]	Contact Finish - Post	Features	Housing Material	Contact Finish - Mating	Pitch - Mating	Pitch - Mating	Pitch - Post	Pitch - Post	Type	Type	Contact Material - Mating	Termination	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid)	Mounting Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating
Aries Electronics 24-4518-01	0.125 in	3.18 mm	3 A	UL94 V-0	200 µin	5.08 µm	Brass	Tin	Open Frame	Polyamide (PA46) Nylon 4/6 Glass Filled	Gold	0.1 "	2.54 mm	0.1 in	2.54 mm	0.4 in	DIP	Beryllium Copper	Solder	12	2	24	Through Hole	0.25 µm	10 µin
Aries Electronics 24-4518-10H	0.125 in	3.18 mm	3 A	UL94 V-0	200 µin	5.08 µm	Brass	Tin	Open Frame	Polyamide (PA46) Nylon 4/6 Glass Filled	Gold	0.1 "	2.54 mm	0.1 in	2.54 mm	0.4 in	DIP	Beryllium Copper	Solder	12	2	24	Through Hole	0.25 µm	10 µin
Aries Electronics 24-4518-10	0.125 in	3.18 mm	3 A	UL94 V-0	200 µin	5.08 µm	Brass	Tin	Open Frame	Polyamide (PA46) Nylon 4/6 Glass Filled	Gold	0.1 "	2.54 mm	0.1 in	2.54 mm	0.4 in	DIP	Beryllium Copper	Solder	12	2	24	Through Hole	0.25 µm	10 µin
Aries Electronics 24-4518-00	0.125 in	3.18 mm	3 A	UL94 V-0	200 µin	5.08 µm	Brass	Tin	Open Frame	Polyamide (PA46) Nylon 4/6 Glass Filled	Gold	0.1 "	2.54 mm	0.1 in	2.54 mm	0.4 in	DIP	Beryllium Copper	Solder	12	2	24	Surface Mount	0.25 µm	10 µin
Aries Electronics 24-4518-10M	0.125 in	3.18 mm	3 A	UL94 V-0	200 µin	5.08 µm	Brass	Tin	Open Frame	Polyamide (PA46) Nylon 4/6 Glass Filled	Gold	0.1 "	2.54 mm	0.1 in	2.54 mm	0.4 in	DIP	Beryllium Copper	Solder	12	2	24	Through Hole	0.25 µm	10 µin