24-6518 Series

Catalog

CONN IC DIP SOCKET 24POS GOLD

Part	Material Flammability Rating	Current Rating (Amps)	Termination Post Length	Termination Post Length	Pitch - Post	Pitch - Post	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Contact Material - Mating	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid)	Contact Material - Post [custom]	Contact Finish - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Type [custom]	Type [custom]	Type	Housing Material	Contact Finish - Post	Mounting Type	Termination
Aries Electronics 24-6518-10E	UL94 V-0	3 A	0.125 in	3.18 mm	0.1 in	2.54 mm	Open Frame	0.25 µm	10 µin	0.1 "	2.54 mm	Beryllium Copper	12	2	24	Brass	Gold	200 µin	5.08 µm	15.24 mm	0.6 in	DIP	Polyamide (PA46) Nylon 4/6 Glass Filled	Tin	Through Hole	Solder
Aries Electronics 24-6518-01	UL94 V-0	3 A	0.125 in	3.18 mm	0.1 in	2.54 mm	Open Frame	0.25 µm	10 µin	0.1 "	2.54 mm	Beryllium Copper	12	2	24	Brass	Gold	10 Áin	0.25 çm	15.24 mm	0.6 in	DIP	Polyamide (PA46) Nylon 4/6 Glass Filled	Gold	Through Hole	Solder
Aries Electronics 24-6518-10	UL94 V-0	3 A	0.125 in	3.18 mm	0.1 in	2.54 mm	Open Frame	0.25 µm	10 µin	0.1 "	2.54 mm	Beryllium Copper	12	2	24	Brass	Gold	200 µin	5.08 µm	15.24 mm	0.6 in	DIP	Polyamide (PA46) Nylon 4/6 Glass Filled	Tin	Through Hole	Solder
Aries Electronics 24-6518-101H	UL94 V-0	3 A	0.125 in	3.18 mm	0.1 in	2.54 mm	Open Frame	0.25 µm	10 µin	0.1 "	2.54 mm	Beryllium Copper	12	2	24	Brass	Gold	200 µin	5.08 µm	15.24 mm	0.6 in	DIP	Polyamide (PA46) Nylon 4/6 Glass Filled	Tin	Through Hole	Solder
Aries Electronics 24-6518-10H	UL94 V-0	3 A	0.125 in	3.18 mm	0.1 in	2.54 mm	Open Frame	0.25 µm	10 µin	0.1 "	2.54 mm	Beryllium Copper	12	2	24	Brass	Gold	200 µin	5.08 µm	15.24 mm	0.6 in	DIP	Polyamide (PA46) Nylon 4/6 Glass Filled	Tin	Through Hole	Solder
Aries Electronics 24-6518-101	UL94 V-0	3 A	0.125 in	3.18 mm	0.1 in	2.54 mm	Open Frame	0.25 µm	10 µin	0.1 "	2.54 mm	Beryllium Copper	12	2	24	Brass	Gold	200 µin	5.08 µm	15.24 mm	0.6 in	DIP	Polyamide (PA46) Nylon 4/6 Glass Filled	Tin	Through Hole	Solder
Aries Electronics 24-6518-11H	UL94 V-0	3 A	0.125 in	3.18 mm	0.1 in	2.54 mm	Open Frame	0.25 µm	10 µin	0.1 "	2.54 mm	Beryllium Copper	12	2	24	Brass	Gold	10 Áin	0.25 çm	15.24 mm	0.6 in	DIP	Polyamide (PA46) Nylon 4/6 Glass Filled	Gold	Through Hole	Solder
Aries Electronics 24-6518-00	UL94 V-0	3 A	0.125 in	3.18 mm	0.1 in	2.54 mm	Open Frame	0.25 µm	10 µin	0.1 "	2.54 mm	Beryllium Copper	12	2	24	Brass	Gold	200 µin	5.08 µm	15.24 mm	0.6 in	DIP	Polyamide (PA46) Nylon 4/6 Glass Filled	Tin	Surface Mount	Solder
Aries Electronics 24-6518-102	UL94 V-0	3 A	0.125 in	3.18 mm	0.1 in	2.54 mm	Open Frame	0.25 µm	10 µin	0.1 "	2.54 mm	Beryllium Copper	12	2	24	Brass	Gold	200 µin	5.08 µm	15.24 mm	0.6 in	DIP	Polyamide (PA46) Nylon 4/6 Glass Filled	Tin	Through Hole	Solder