48-3574 Series

Catalog

CONN IC DIP SOCKET ZIF 48POS TIN

Part	Current Rating (Amps)	Termination Post Length	Termination Post Length	Material Flammability Rating	Contact Finish - Post	Contact Material - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Features	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Type	Type	Type	Termination	Pitch - Post	Pitch - Post	Mounting Type	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [x]	Pitch - Mating	Pitch - Mating	Contact Material - Post	Housing Material
Aries Electronics 48-3574-16	1 A	0.11 in	2.78 mm	UL94 V-0	Tin	Beryllium Copper	5.08 µm	200 µin	Closed Frame	200 µin	5.08 µm	DIP ZIF (ZIP)	7.62 mm	0.3 in	Solder	0.1 in	2.54 mm	Through Hole	2	48	24	0.1 "	2.54 mm	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 48-3574-10	1 A	0.11 in	2.78 mm	UL94 V-0	Tin	Beryllium Copper	5.08 µm	200 µin	Closed Frame	200 µin	5.08 µm	DIP ZIF (ZIP)	7.62 mm	0.3 in	Solder	0.1 in	2.54 mm	Through Hole	2	48	24	0.1 "	2.54 mm	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 48-3574-11	1 A	0.11 in	2.78 mm	UL94 V-0	Tin	Beryllium Copper	5.08 µm	200 µin	Closed Frame	200 µin	5.08 µm	DIP ZIF (ZIP)	7.62 mm	0.3 in	Solder	0.1 in	2.54 mm	Through Hole	2	48	24	0.1 "	2.54 mm	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 48-3574-18	1 A	0.11 in	2.78 mm	UL94 V-0	Tin	Beryllium Copper	5.08 µm	200 µin	Closed Frame	200 µin	5.08 µm	DIP ZIF (ZIP)	7.62 mm	0.3 in	Solder	0.1 in	2.54 mm	Through Hole	2	48	24	0.1 "	2.54 mm	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled