48-6508 Series

Catalog

CONN IC DIP SOCKET 48POS GOLD

Part	Current Rating (Amps)	Material Flammability Rating	Termination Post Length	Termination Post Length	Type [custom]	Type [custom]	Type	Housing Material	Pitch - Post	Pitch - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Post	Contact Finish - Mating	Features	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [x]	Termination	Pitch - Mating	Pitch - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Contact Material - Post [custom]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Mounting Type	Contact Material - Mating
Aries Electronics 48-6508-20	3 A	UL94 V-0	9.14 mm	0.36 in	15.24 mm	0.6 in	DIP	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	200 µin	5.08 µm	Tin	Gold	Open Frame	2	48	24	Wire Wrap	0.1 "	2.54 mm	-55 C	105 ░C	Brass	0.76 Ám	30 Áin	Through Hole	Beryllium Copper
Aries Electronics 48-6508-31	3 A	UL94 V-0	12.7 mm	0.5 in	15.24 mm	0.6 in	DIP	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	10 Áin	0.25 çm	Gold	Gold	Open Frame	2	48	24	Wire Wrap	0.1 "	2.54 mm	-55 C	125 °C	Brass	0.76 Ám	30 Áin	Through Hole	Beryllium Copper
Aries Electronics 48-6508-30	3 A	UL94 V-0	12.7 mm	0.5 in	15.24 mm	0.6 in	DIP	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	200 µin	5.08 µm	Tin	Gold	Open Frame	2	48	24	Wire Wrap	0.1 "	2.54 mm	-55 C	105 ░C	Brass	0.76 Ám	30 Áin	Through Hole	Beryllium Copper
Aries Electronics 48-6508-21	3 A	UL94 V-0	9.14 mm	0.36 in	15.24 mm	0.6 in	DIP	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	10 Áin	0.25 çm	Gold	Gold	Open Frame	2	48	24	Wire Wrap	0.1 "	2.54 mm	-55 C	125 °C	Brass	0.76 Ám	30 Áin	Through Hole	Beryllium Copper