32-6556 Series

Catalog

CONN IC DIP SOCKET 32POS GOLD

Part	Material Flammability Rating	Termination Post Length	Termination Post Length	Current Rating (Amps)	Contact Material - Mating	Number of Positions or Pins (Grid)	Contact Finish - Post	Type [custom]	Type [custom]	Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Housing Material	Contact Finish - Mating	Mounting Type	Contact Material - Post [custom]	Pitch - Mating	Pitch - Mating	Pitch - Post	Pitch - Post	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination
Aries Electronics 32-6556-41	UL94 V-0	0.18 in	4.57 mm	3 A	Beryllium Copper	32	Gold	15.24 mm	0.6 in	DIP	10 Áin	0.25 çm	Polyphenylene Sulfide (PPS) Glass Filled	Gold	Through Hole	Brass	0.1 "	2.54 mm	0.1 in	2.54 mm	Open Frame	0.76 Ám	30 Áin
Aries Electronics 32-6556-31	UL94 V-0	0.423 in	10.74 mm	3 A	Beryllium Copper	32	Gold	15.24 mm	0.6 in	DIP	10 Áin	0.25 çm	Polyphenylene Sulfide (PPS) Glass Filled	Gold	Through Hole	Brass	0.1 "	2.54 mm	0.1 in	2.54 mm	Open Frame	0.76 Ám	30 Áin	Wire Wrap
Aries Electronics 32-6556-10	UL94 V-0	0.13 in	3.3 mm	3 A	Beryllium Copper	32	Tin	15.24 mm	0.6 in	DIP	200 µin	5.08 µm	Polyphenylene Sulfide (PPS) Glass Filled	Gold	Through Hole	Brass	0.1 "	2.54 mm	0.1 in	2.54 mm	Open Frame	0.76 Ám	30 Áin	Solder
Aries Electronics 32-6556-40	UL94 V-0	0.18 in	4.57 mm	3 A	Beryllium Copper	32	Tin	15.24 mm	0.6 in	DIP	200 µin	5.08 µm	Polyphenylene Sulfide (PPS) Glass Filled	Gold	Through Hole	Brass	0.1 "	2.54 mm	0.1 in	2.54 mm	Open Frame	0.76 Ám	30 Áin