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SN74LVC1G27

SN74LVC1G27 Series

Single 3-input, 1.65-V to 5.5-V NOR gate

Manufacturer: Texas Instruments

Catalog

Single 3-input, 1.65-V to 5.5-V NOR gate

Key Features

Available in the Texas Instruments NanoFree PackageSupports 5-V VCCOperationInputs Accept Voltages to 5.5 VSupports Down Translation to VCCMax tpdof 4.5 ns at 3.3 VLow Power Consumption, 10-µA Max ICC±24-mA Output Drive at 3.3 VIoffSupports Live Insertion, Partial-Power-Down Mode, and Back-Drive ProtectionLatch-Up Performance Exceeds 100 mA PerJESD 78, Class IIESD Protection Exceeds JESD 222000-V Human-Body Model (A114-A)200-V Machine Model (A115-A)1000-V Charged-Device Model (C101)Available in the Texas Instruments NanoFree PackageSupports 5-V VCCOperationInputs Accept Voltages to 5.5 VSupports Down Translation to VCCMax tpdof 4.5 ns at 3.3 VLow Power Consumption, 10-µA Max ICC±24-mA Output Drive at 3.3 VIoffSupports Live Insertion, Partial-Power-Down Mode, and Back-Drive ProtectionLatch-Up Performance Exceeds 100 mA PerJESD 78, Class IIESD Protection Exceeds JESD 222000-V Human-Body Model (A114-A)200-V Machine Model (A115-A)1000-V Charged-Device Model (C101)

Description

AI
The SN74LVC1G27 device performs the Boolean function Y =A + B + Cor Y =A•B•Cin positive logic. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The SN74LVC1G27 device performs the Boolean function Y =A + B + Cor Y =A•B•Cin positive logic. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.