50-9518 Series

Catalog

CONN IC DIP SOCKET 50POS GOLD

Part	Current Rating (Amps)	Material Flammability Rating	Termination Post Length	Termination Post Length	Mounting Type	Features	Contact Finish - Post	Contact Material - Mating	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [y]	Pitch - Post	Pitch - Post	Contact Material - Post [custom]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Housing Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Type	Type	Type	Termination
Aries Electronics 50-9518-11H	3 A	UL94 V-0	0.125 in	3.18 mm	Through Hole	Open Frame	Gold	Beryllium Copper	0.1 "	2.54 mm	Gold	2	50	25	0.1 in	2.54 mm	Brass	0.25 µm	10 µin	Polyamide (PA46) Nylon 4/6 Glass Filled	10 Áin	0.25 çm	DIP	22.86 mm	0.9 in	Solder
Aries Electronics 50-9518-10T	3 A	UL94 V-0	0.125 in	3.18 mm	Through Hole	Open Frame	Tin	Beryllium Copper	0.1 "	2.54 mm	Gold	2	50	25	0.1 in	2.54 mm	Brass	0.25 µm	10 µin	Polyamide (PA46) Nylon 4/6 Glass Filled	200 µin	5.08 µm	DIP	22.86 mm	0.9 in	Solder
Aries Electronics 50-9518-10E	3 A	UL94 V-0	0.125 in	3.18 mm	Through Hole	Open Frame	Tin	Beryllium Copper	0.1 "	2.54 mm	Gold	2	50	25	0.1 in	2.54 mm	Brass	0.25 µm	10 µin	Polyamide (PA46) Nylon 4/6 Glass Filled	200 µin	5.08 µm	DIP	22.86 mm	0.9 in	Solder
Aries Electronics 50-9518-10H	3 A	UL94 V-0	0.125 in	3.18 mm	Through Hole	Open Frame	Tin	Beryllium Copper	0.1 "	2.54 mm	Gold	2	50	25	0.1 in	2.54 mm	Brass	0.25 µm	10 µin	Polyamide (PA46) Nylon 4/6 Glass Filled	200 µin	5.08 µm	DIP	22.86 mm	0.9 in	Solder
Aries Electronics 50-9518-10M	3 A	UL94 V-0	0.125 in	3.18 mm	Through Hole	Open Frame	Tin	Beryllium Copper	0.1 "	2.54 mm	Gold	2	50	25	0.1 in	2.54 mm	Brass	0.25 µm	10 µin	Polyamide (PA46) Nylon 4/6 Glass Filled	200 µin	5.08 µm	DIP	22.86 mm	0.9 in	Solder
Aries Electronics 50-9518-10	3 A	UL94 V-0	0.125 in	3.18 mm	Through Hole	Open Frame	Tin	Beryllium Copper	0.1 "	2.54 mm	Gold	2	50	25	0.1 in	2.54 mm	Brass	0.25 µm	10 µin	Polyamide (PA46) Nylon 4/6 Glass Filled	200 µin	5.08 µm	DIP	22.86 mm	0.9 in	Solder