84-PRS1 Series
Manufacturer: Aries Electronics
Beta
⌘K
IC & COMPONENT SOCKETS 84 PIN PGA GOLD
| Part | Termination Post Length | Termination Post Length | Current Rating (Amps) | Material Flammability Rating | Contact Material - Mating | Contact Finish - Mating | Termination | Pitch - Mating | Pitch - Mating | Type | Features | Pitch - Post | Pitch - Post | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Post | Mounting Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 0.125 in | 3.18 mm | 1 A | UL94 V-0 | Beryllium Copper | Gold | Solder | 0.1 " | 2.54 mm | PGA ZIF (ZIP) | Closed Frame | 0.1 in | 2.54 mm | -65 ░C | 125 °C | 200 µin | 5.08 µm | Beryllium Copper | Through Hole | 0.76 Ám | 30 Áin | Tin |
Aries Electronics | 0.125 in | 3.18 mm | 1 A | UL94 V-0 | Beryllium Copper | Gold | Solder | 0.1 " | 2.54 mm | PGA ZIF (ZIP) | Closed Frame | 0.1 in | 2.54 mm | -65 ░C | 125 °C | 200 µin | 5.08 µm | Beryllium Copper | Through Hole | 0.76 Ám | 30 Áin | Tin |
Aries Electronics | 0.125 in | 3.18 mm | 1 A | UL94 V-0 | Beryllium Copper | Gold | Solder | 0.1 " | 2.54 mm | PGA ZIF (ZIP) | Closed Frame | 0.1 in | 2.54 mm | -65 ░C | 125 °C | 200 µin | 5.08 µm | Beryllium Copper | Through Hole | 0.76 Ám | 30 Áin | Tin |
Aries Electronics | 0.125 in | 3.18 mm | 1 A | UL94 V-0 | Beryllium Copper | Gold | Solder | 0.1 " | 2.54 mm | PGA ZIF (ZIP) | Closed Frame | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | Beryllium Copper | Through Hole | 0.76 Ám | 30 Áin | Tin | ||
Aries Electronics | 0.125 in | 3.18 mm | 1 A | UL94 V-0 | Beryllium Copper | Gold | Solder | 0.1 " | 2.54 mm | PGA ZIF (ZIP) | Closed Frame | 0.1 in | 2.54 mm | -65 ░C | 125 °C | 200 µin | 5.08 µm | Beryllium Copper | Through Hole | 0.76 Ám | 30 Áin | Tin |
Aries Electronics | 0.125 in | 3.18 mm | 1 A | UL94 V-0 | Beryllium Copper | Gold | Solder | 0.1 " | 2.54 mm | PGA ZIF (ZIP) | Closed Frame | 0.1 in | 2.54 mm | -65 ░C | 125 °C | 200 µin | 5.08 µm | Beryllium Copper | Through Hole | 0.76 Ám | 30 Áin | Tin |