MCP2004 Series
Manufacturer: Microchip Technology
IC TRANSCEIVER HALF 1/1 8SOIC
| Part | Supplier Device Package | Receiver Hysteresis | Voltage - Supply [Max] | Voltage - Supply [Min] | Protocol | Type | Duplex | Package / Case | Package / Case [y] | Package / Case [x] | Operating Temperature [Max] | Operating Temperature [Min] | Mounting Type | Package / Case | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology | 8-SOIC | 175 mV | 27 V | 6 V | LINbus | Transceiver | Half | 8-SOIC | 3.9 mm | 0.154 in | 125 °C | -40 °C | Surface Mount | ||
Microchip Technology | 8-SOIC | 175 mV | 27 V | 6 V | LINbus | Transceiver | Half | 8-SOIC | 3.9 mm | 0.154 in | 125 °C | -40 °C | Surface Mount | ||
Microchip Technology | 8-DFN (4x4) | 175 mV | 27 V | 6 V | LINbus | Transceiver | Half | 8-VDFN Exposed Pad | 125 °C | -40 °C | Surface Mount | ||||
Microchip Technology | 8-SOIC | 175 mV | 27 V | 6 V | LINbus | Transceiver | Half | 8-SOIC | 3.9 mm | 0.154 in | 125 °C | -40 °C | Surface Mount | ||
Microchip Technology | 8-DFN (4x4) | 175 mV | 27 V | 6 V | LINbus | Transceiver | Half | 8-VDFN Exposed Pad | 125 °C | -40 °C | Surface Mount | ||||
Microchip Technology | 8-PDIP | 175 mV | 27 V | 6 V | LINbus | Transceiver | Half | 8-DIP | 125 °C | -40 °C | Through Hole | 0.3 in | 7.62 mm |