10-3503 Series

Catalog

CONN IC DIP SOCKET 10POS GOLD

Part	Current Rating (Amps)	Termination Post Length	Termination Post Length	Material Flammability Rating	Termination	Contact Material - Mating	Contact Finish - Post	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish - Mating	Features	Housing Material	Pitch - Post	Pitch - Post	Pitch - Mating	Pitch - Mating	Contact Material - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Mounting Type	Type	Type	Type	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [x]	Contact Finish Thickness - Post	Contact Finish Thickness - Post
Aries Electronics 10-3503-31	3 A	0.5 in	12.7 mm	UL94 V-0	Wire Wrap	Beryllium Copper	Gold	-55 C	125 °C	Gold	Closed Frame	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	0.1 "	2.54 mm	Phosphor Bronze	0.25 µm	10 µin	Through Hole	7.62 mm	0.3 in	DIP	5	10	2	10 Áin	0.25 çm
Aries Electronics 10-3503-21	3 A	0.36 in	9.14 mm	UL94 V-0	Wire Wrap	Beryllium Copper	Gold	-55 C	125 °C	Gold	Closed Frame	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	0.1 "	2.54 mm	Phosphor Bronze	0.25 µm	10 µin	Through Hole	7.62 mm	0.3 in	DIP	5	10	2	10 Áin	0.25 çm
Aries Electronics 10-3503-20	3 A	0.36 in	9.14 mm	UL94 V-0	Wire Wrap	Beryllium Copper	Tin	-55 C	105 ░C	Gold	Closed Frame	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	0.1 "	2.54 mm	Phosphor Bronze	0.25 µm	10 µin	Through Hole	7.62 mm	0.3 in	DIP	5	10	2	200 µin	5.08 µm