48-6573 Series

Catalog

CONN IC DIP SOCKET ZIF 48POS GLD

Part	Termination Post Length	Termination Post Length	Material Flammability Rating	Current Rating (Amps)	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Contact Finish - Post	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [x]	Contact Material - Mating	Pitch - Post	Pitch - Post	Mounting Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Post	Features	Type	Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Housing Material	Termination
Aries Electronics 48-6573-11	0.11 in	2.78 mm	UL94 V-0	1 A	0.1 "	2.54 mm	Gold	Gold	2	48	24	Beryllium Copper	0.1 in	2.54 mm	Through Hole	10 Áin	0.25 çm	Beryllium Copper	Closed Frame	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	0.25 µm	10 µin	Polyphenylene Sulfide (PPS) Glass Filled	Solder
Aries Electronics 48-6573-16	0.11 in	2.78 mm	UL94 V-0	1 A	0.1 "	2.54 mm	Gold	Gold	2	48	24	Beryllium Copper	0.1 in	2.54 mm	Through Hole	10 Áin	0.25 çm	Beryllium Copper	Closed Frame	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	0.25 µm	10 µin	Polyphenylene Sulfide (PPS) Glass Filled	Solder