08-2511 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET 8POS GOLD
| Part | Material Flammability Rating | Current Rating (Amps) | Termination Post Length | Termination Post Length | Contact Finish - Post | Operating Temperature [Min] | Operating Temperature [Max] | Contact Material - Mating | Type | Type | Termination | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Features | Pitch - Mating | Pitch - Mating | Pitch - Post | Pitch - Post | Mounting Type | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [x] | Number of Positions or Pins (Grid) [y] | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Mating | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | UL94 V-0 | 1 A | 3.81 mm | 0.15 in | Gold | -55 C | 125 °C | Phosphor Bronze | DIP | 5.08 mm | Solder | 10 Áin | 0.25 çm | Closed Frame | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm | Through Hole | 8 | 2 | 4 | 0.25 µm | 10 µin | Gold | Polyamide (PA46) Nylon 4/6 Glass Filled | Phosphor Bronze |
Aries Electronics | UL94 V-0 | 1 A | 3.81 mm | 0.15 in | Tin | -55 C | 105 ░C | Phosphor Bronze | DIP | 5.08 mm | Solder | 200 µin | 5.08 µm | Closed Frame | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm | Through Hole | 8 | 2 | 4 | 5.08 µm | 200 µin | Polyamide (PA46) Nylon 4/6 Glass Filled | Phosphor Bronze |