32-6508 Series

Catalog

CONN IC DIP SOCKET 32POS GOLD

Part	Current Rating (Amps)	Termination Post Length	Termination Post Length	Material Flammability Rating	Features	Contact Material - Mating	Mounting Type	Number of Positions or Pins (Grid)	Contact Finish - Post	Pitch - Post	Pitch - Post	Housing Material	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Termination	Operating Temperature [Min]	Operating Temperature [Max]	Type [custom]	Type [custom]	Type	Contact Material - Post [custom]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post
Aries Electronics 32-6508-31	3 A	0.5 in	12.7 mm	UL94 V-0	Open Frame	Beryllium Copper	Through Hole	32	Gold	0.1 in	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	Gold	Wire Wrap	-55 C	125 °C	15.24 mm	0.6 in	DIP	Brass	0.76 Ám	30 Áin	10 Áin	0.25 çm
Aries Electronics 32-6508-212	3 A	0.5 in	12.7 mm	UL94 V-0	Open Frame	Beryllium Copper	Through Hole	32	Gold	0.1 in	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	Gold	Wire Wrap	-55 C	125 °C	15.24 mm	0.6 in	DIP	Brass	0.76 Ám	30 Áin	10 Áin	0.25 çm
Aries Electronics 32-6508-311	3 A	0.5 in	12.7 mm	UL94 V-0	Open Frame	Beryllium Copper	Through Hole	32	Gold	0.1 in	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	Gold	Wire Wrap	-55 C	125 °C	15.24 mm	0.6 in	DIP	Brass	0.76 Ám	30 Áin	10 Áin	0.25 çm
Aries Electronics 32-6508-302	3 A	0.36 in	9.14 mm	UL94 V-0	Open Frame	Beryllium Copper	Through Hole	32	Tin	0.1 in	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	Gold	Wire Wrap	-55 C	105 ░C	15.24 mm	0.6 in	DIP	Brass	0.76 Ám	30 Áin	200 µin	5.08 µm
Aries Electronics 32-6508-301	3 A	0.36 in	9.14 mm	UL94 V-0	Open Frame	Beryllium Copper	Through Hole	32	Tin	0.1 in	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	Gold	Wire Wrap	-55 C	105 ░C	15.24 mm	0.6 in	DIP	Brass	0.76 Ám	30 Áin	200 µin	5.08 µm
Aries Electronics 32-6508-312	3 A	0.5 in	12.7 mm	UL94 V-0	Open Frame	Beryllium Copper	Through Hole	32	Gold	0.1 in	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	Gold	Wire Wrap	-55 C	125 °C	15.24 mm	0.6 in	DIP	Brass	0.76 Ám	30 Áin	10 Áin	0.25 çm
Aries Electronics 32-6508-202	3 A	0.36 in	9.14 mm	UL94 V-0	Open Frame	Beryllium Copper	Through Hole	32	Tin	0.1 in	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	Gold	Wire Wrap	-55 C	105 ░C	15.24 mm	0.6 in	DIP	Brass	0.76 Ám	30 Áin	200 µin	5.08 µm
Aries Electronics 32-6508-211	3 A	0.5 in	12.7 mm	UL94 V-0	Open Frame	Beryllium Copper	Through Hole	32	Gold	0.1 in	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	Gold	Wire Wrap	-55 C	125 °C	15.24 mm	0.6 in	DIP	Brass	0.76 Ám	30 Áin	10 Áin	0.25 çm
Aries Electronics 32-6508-21	3 A	0.5 in	12.7 mm	UL94 V-0	Open Frame	Beryllium Copper	Through Hole	32	Gold	0.1 in	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	Gold	Wire Wrap	-55 C	125 °C	15.24 mm	0.6 in	DIP	Brass	0.76 Ám	30 Áin	10 Áin	0.25 çm