04-1518 Series

Catalog

CONN IC DIP SOCKET 4POS GOLD

Part	Material Flammability Rating	Termination Post Length	Termination Post Length	Current Rating (Amps)	Mounting Type	Features	Contact Material - Mating	Pitch - Post	Pitch - Post	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Housing Material	Contact Material - Post [custom]	Contact Finish - Post	Type	Type	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid)	Contact Finish - Mating	Termination	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating
Aries Electronics 04-1518-10T	UL94 V-0	0.125 in	3.18 mm	3 A	Through Hole	Open Frame	Beryllium Copper	0.1 in	2.54 mm	0.1 "	2.54 mm	200 µin	5.08 µm	Polyamide (PA46) Nylon 4/6 Glass Filled	Brass	Tin	DIP	5.08 mm	2 x 2	4 pins	Gold	Solder	0.25 µm	10 µin
Aries Electronics 04-1518-00	UL94 V-0	0.125 in	3.18 mm	3 A	Surface Mount	Open Frame	Beryllium Copper	0.1 in	2.54 mm	0.1 "	2.54 mm	200 µin	5.08 µm	Polyamide (PA46) Nylon 4/6 Glass Filled	Brass	Tin	DIP	5.08 mm	2 x 2	4 pins	Gold	Solder	0.25 µm	10 µin
Aries Electronics 04-1518-11H	UL94 V-0	0.125 in	3.18 mm	3 A	Through Hole	Open Frame	Beryllium Copper	0.1 in	2.54 mm	0.1 "	2.54 mm	10 Áin	0.25 çm	Polyamide (PA46) Nylon 4/6 Glass Filled	Brass	Gold	DIP	5.08 mm	2 x 2	4 pins	Gold	Solder	0.25 µm	10 µin
Aries Electronics 04-1518-10	UL94 V-0	0.125 in	3.18 mm	3 A	Through Hole	Open Frame	Beryllium Copper	0.1 in	2.54 mm	0.1 "	2.54 mm	200 µin	5.08 µm	Polyamide (PA46) Nylon 4/6 Glass Filled	Brass	Tin	DIP	5.08 mm	2 x 2	4 pins	Gold	Solder	0.25 µm	10 µin
Aries Electronics 04-1518-10H	UL94 V-0	0.125 in	3.18 mm	3 A	Through Hole	Open Frame	Beryllium Copper	0.1 in	2.54 mm	0.1 "	2.54 mm	200 µin	5.08 µm	Polyamide (PA46) Nylon 4/6 Glass Filled	Brass	Tin	DIP	5.08 mm	2 x 2	4 pins	Gold	Solder	0.25 µm	10 µin