BM23FR0.8 Series
Manufacturer: Hirose Electric Co Ltd
CONN HDR 10POS SMD GOLD
| Part | Pitch | Pitch | Number of Rows [custom] | Features | Number of Positions | Mounting Type | Contact Finish | Mated Stacking Heights | Height Above Board [z] | Height Above Board [z] | Connector Type | Contact Finish Thickness | Contact Finish Thickness |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Hirose Electric Co Ltd | 0.014 in | 0.35 mm | 2 | Solder Retention | 10 | Surface Mount | Gold | 0.8 mm | 0.63 mm | 0.025 in | Header Outer Shroud Contacts | 1.97 Áin | 0.05 Ám |
Hirose Electric Co Ltd | 0.014 in | 0.35 mm | 2 | Solder Retention | 18 | Surface Mount | Gold | 0.8 mm | 0.63 mm | 0.025 in | Header Outer Shroud Contacts | 1.97 Áin | 0.05 Ám |
Hirose Electric Co Ltd | 0.014 in | 0.35 mm | 2 | Solder Retention | 10 | Surface Mount | Gold | 0.8 mm | 0.8 mm | 0.031 in | Receptacle Center Strip Contacts | 1.97 Áin | 0.05 Ám |
Hirose Electric Co Ltd | 0.014 in | 0.35 mm | 2 | Solder Retention | 60 | Surface Mount | Gold | 0.8 mm | 0.8 mm | 0.031 in | Receptacle Center Strip Contacts | 1.97 Áin | 0.05 Ám |
Hirose Electric Co Ltd | 0.014 in | 0.35 mm | 2 | Solder Retention | 10 | Surface Mount | Gold | 0.8 mm | 0.8 mm | 0.031 in | Receptacle Center Strip Contacts | 1.97 Áin | 0.05 Ám |
Hirose Electric Co Ltd | 0.014 in | 0.35 mm | 2 | Solder Retention | 10 | Surface Mount | Gold | 0.8 mm | 0.63 mm | 0.025 in | Header Outer Shroud Contacts | 1.97 Áin | 0.05 Ám |
Hirose Electric Co Ltd | 0.014 in | 0.35 mm | 2 | Solder Retention | 18 | Surface Mount | Gold | 0.8 mm | 0.63 mm | 0.025 in | Header Outer Shroud Contacts | 1.97 Áin | 0.05 Ám |
Hirose Electric Co Ltd | 0.014 in | 0.35 mm | 2 | Solder Retention | 18 | Surface Mount | Gold | 0.8 mm | 0.8 mm | 0.031 in | Receptacle Center Strip Contacts | 1.97 Áin | 0.05 Ám |