800 Series

Catalog

IC & COMPONENT SOCKETS 20P VERTICAL DISPLAY

Part	Current Rating (Amps)	Material Flammability Rating	Termination Post Length	Termination Post Length	Pitch - Mating	Pitch - Mating	Housing Material	Contact Material - Post	Type	Type	Type	Pitch - Post	Pitch - Post	Termination	Features	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]	Contact Material - Post [custom]	Type [custom]	Type [custom]	Contact Finish - Mating	Mounting Type	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]
Aries Electronics 20-823-90T	1.5 A	UL94 V-0	0.145 in	3.68 mm	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6	Phosphor Bronze	7.62 mm	0.3 in	DIP	0.1 in	2.54 mm	Solder	Closed Frame	Tin	5.08 µm	200 µin	-55 C	105 ░C	20	Phosphor Bronze	200 µin	5.08 µm
Aries Electronics 24-6823-90C	3 A	UL94 V-0	0.14 in	3.56 mm	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled				DIP	0.1 in	2.54 mm	Solder	Closed Frame	Tin	0.76 Ám	30 Áin	-55 C	105 ░C	24	Beryllium Copper	200 µin	5.08 µm	12	2	Brass	15.24 mm	0.6 in	Gold
Aries Electronics 18-810-90T					0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6	Phosphor Bronze	7.62 mm	0.3 in	DIP	0.1 in	2.54 mm	Solder	Closed Frame	Tin	5.08 µm	200 µin			18	Phosphor Bronze	200 µin	5.08 µm							Right Angle Through Hole Vertical
Aries Electronics 24-6823-90T	1.5 A	UL94 V-0	0.145 in	3.68 mm	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6	Phosphor Bronze			DIP	0.1 in	2.54 mm	Solder	Closed Frame	Tin	5.08 µm	200 µin			24	Phosphor Bronze	200 µin	5.08 µm	12	2		15.24 mm	0.6 in
Aries Electronics 16-6822-90C	3 A	UL94 V-0	0.14 in	3.56 mm	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled				DIP	0.1 in	2.54 mm	Solder	Closed Frame	Tin	0.76 Ám	30 Áin	-55 C	105 ░C	16	Beryllium Copper	200 µin	5.08 µm			Brass	15.24 mm	0.6 in	Gold		2	8
Aries Electronics 48-6823-90C					0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled				DIP	0.1 in	2.54 mm	Solder	Closed Frame	Tin	0.76 Ám	30 Áin	-55 C	105 ░C		Beryllium Copper	200 µin	5.08 µm	24	2	Brass	15.24 mm	0.6 in	Gold				48
Aries Electronics 14-823-90	1.5 A	UL94 V-0	0.145 in	3.68 mm	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6	Phosphor Bronze	7.62 mm	0.3 in	DIP	0.1 in	2.54 mm	Solder	Closed Frame	Gold	0.25 µm	10 µin			14	Phosphor Bronze	10 Áin	0.25 çm						Gold
Aries Electronics 16-822-90	1.5 A	UL94 V-0	0.145 in	3.68 mm	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6	Phosphor Bronze	7.62 mm	0.3 in	DIP	0.1 in	2.54 mm	Solder	Closed Frame	Gold	0.25 µm	10 µin			16	Phosphor Bronze	10 Áin	0.25 çm						Gold		2	8
Aries Electronics 08-810-90T					0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6	Phosphor Bronze	7.62 mm	0.3 in	DIP	0.1 in	2.54 mm	Solder	Closed Frame	Tin	5.08 µm	200 µin			8	Phosphor Bronze	200 µin	5.08 µm	2	4					Right Angle Through Hole Vertical
Aries Electronics 22-6823-90	1.5 A	UL94 V-0	0.145 in	3.68 mm	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6	Phosphor Bronze			DIP	0.1 in	2.54 mm	Solder	Closed Frame	Gold	0.25 µm	10 µin			22	Phosphor Bronze	10 Áin	0.25 çm	2	11		15.24 mm	0.6 in	Gold