04-1508 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET 4POS GOLD
| Part | Material Flammability Rating | Termination Post Length | Termination Post Length | Current Rating (Amps) | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Type | Type | Housing Material | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) | Termination | Contact Finish - Post | Mounting Type | Contact Finish - Mating | Contact Material - Post [custom] | Features | Contact Material - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Post | Pitch - Post | Pitch - Mating | Pitch - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | UL94 V-0 | 9.14 mm | 0.36 in | 3 A | -55 C | 125 °C | 10 Áin | 0.25 çm | DIP | 5.08 mm | Polyamide (PA46) Nylon 4/6 | 2 x 2 | 4 pins | Wire Wrap | Gold | Through Hole | Gold | Brass | Closed Frame | Beryllium Copper | 0.25 µm | 10 µin | 0.1 in | 2.54 mm | 0.1 " | 2.54 mm |
Aries Electronics | UL94 V-0 | 9.14 mm | 0.36 in | 3 A | -55 C | 105 ░C | 200 µin | 5.08 µm | DIP | 5.08 mm | Polyamide (PA46) Nylon 4/6 | 2 x 2 | 4 pins | Wire Wrap | Tin | Through Hole | Gold | Brass | Closed Frame | Beryllium Copper | 0.25 µm | 10 µin | 0.1 in | 2.54 mm | 0.1 " | 2.54 mm |
Aries Electronics | UL94 V-0 | 12.7 mm | 0.5 in | 3 A | -55 C | 105 ░C | 200 µin | 5.08 µm | DIP | 5.08 mm | Polyamide (PA46) Nylon 4/6 | 2 x 2 | 4 pins | Wire Wrap | Tin | Through Hole | Gold | Brass | Closed Frame | Beryllium Copper | 0.25 µm | 10 µin | 0.1 in | 2.54 mm | 0.1 " | 2.54 mm |