18-1518 Series

Catalog

CONN IC DIP SOCKET 18POS GOLD

Part	Termination Post Length	Termination Post Length	Material Flammability Rating	Current Rating (Amps)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Post	Pitch - Post	Contact Material - Post [custom]	Contact Material - Mating	Termination	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Housing Material	Number of Positions or Pins (Grid)	Contact Finish - Mating	Features	Type	Type	Contact Finish - Post	Mounting Type
Aries Electronics 18-1518-10	0.125 in	3.18 mm	UL94 V-0	3 A	200 µin	5.08 µm	0.1 in	2.54 mm	Brass	Beryllium Copper	Solder	0.25 µm	10 µin	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	18	Gold	Open Frame	DIP	5.08 mm	Tin	Through Hole
Aries Electronics 18-1518-00	0.125 in	3.18 mm	UL94 V-0	3 A	200 µin	5.08 µm	0.1 in	2.54 mm	Brass	Beryllium Copper	Solder	0.25 µm	10 µin	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	18	Gold	Open Frame	DIP	5.08 mm	Tin	Surface Mount
Aries Electronics 18-1518-10H	0.125 in	3.18 mm	UL94 V-0	3 A	200 µin	5.08 µm	0.1 in	2.54 mm	Brass	Beryllium Copper	Solder	0.25 µm	10 µin	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	18	Gold	Open Frame	DIP	5.08 mm	Tin	Through Hole