28-6572 Series

Catalog

CONN IC DIP SOCKET ZIF 28POS TIN

Part	Current Rating (Amps)	Material Flammability Rating	Termination Post Length	Termination Post Length	Contact Material - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Features	Mounting Type	Type	Type	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid)	Pitch - Post	Pitch - Post	Termination	Housing Material
Aries Electronics 28-6572-16	1 A	UL94 V-0	0.11 in	2.78 mm	Beryllium Copper	200 µin	5.08 µm	Closed Frame	Through Hole	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Tin	5.08 µm	200 µin	Beryllium Copper	0.1 "	2.54 mm	28	0.1 in	2.54 mm	Solder	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 28-6572-18	1 A	UL94 V-0	0.11 in	2.78 mm	Beryllium Copper	200 µin	5.08 µm	Closed Frame	Through Hole	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Tin	5.08 µm	200 µin	Beryllium Copper	0.1 "	2.54 mm	28	0.1 in	2.54 mm	Solder	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 28-6572-10	1 A	UL94 V-0	0.11 in	2.78 mm	Beryllium Copper	200 µin	5.08 µm	Closed Frame	Through Hole	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Tin	5.08 µm	200 µin	Beryllium Copper	0.1 "	2.54 mm	28	0.1 in	2.54 mm	Solder	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 28-6572-11	1 A	UL94 V-0	0.11 in	2.78 mm	Beryllium Copper	200 µin	5.08 µm	Closed Frame	Through Hole	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Tin	5.08 µm	200 µin	Beryllium Copper	0.1 "	2.54 mm	28	0.1 in	2.54 mm	Solder	Polyphenylene Sulfide (PPS) Glass Filled