08-2513 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET 8POS GOLD
| Part | Material Flammability Rating | Current Rating (Amps) | Termination Post Length | Termination Post Length | Housing Material | Termination | Pitch - Post | Pitch - Post | Pitch - Mating | Pitch - Mating | Contact Finish - Mating | Features | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Operating Temperature [Min] | Operating Temperature [Max] | Mounting Type | Contact Finish - Post | Type | Type | Contact Material - Post [custom] | Contact Material - Mating | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [x] | Number of Positions or Pins (Grid) [y] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | UL94 V-0 | 3 A | 0.125 in | 3.18 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | Solder | 0.1 in | 2.54 mm | 0.1 " | 2.54 mm | Gold | Closed Frame | 0.25 µm | 10 µin | 200 µin | 5.08 µm | -55 C | 105 ░C | Through Hole | Tin | DIP | 5.08 mm | Brass | Beryllium Copper | 8 | 2 | 4 |
 Aries Electronics | UL94 V-0 | 3 A | 0.125 in | 3.18 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | Solder | 0.1 in | 2.54 mm | 0.1 " | 2.54 mm | Gold | Closed Frame | 0.25 µm | 10 µin | 200 µin | 5.08 µm | -55 C | 105 ░C | Through Hole | Tin | DIP | 5.08 mm | Brass | Beryllium Copper | 8 | 2 | 4 |
Aries Electronics | UL94 V-0 | 3 A | 0.125 in | 3.18 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | Solder | 0.1 in | 2.54 mm | 0.1 " | 2.54 mm | Gold | Closed Frame | 0.25 µm | 10 µin | 200 µin | 5.08 µm | -55 C | 105 ░C | Through Hole | Tin | DIP | 5.08 mm | Brass | Beryllium Copper | 8 | 2 | 4 |