30-6823 Series

Catalog

CONN IC DIP SOCKET 30POS GOLD

Part	Current Rating (Amps)	Termination Post Length	Termination Post Length	Material Flammability Rating	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Housing Material	Features	Contact Finish - Post	Pitch - Post	Pitch - Post	Contact Finish - Mating	Type [custom]	Type [custom]	Type	Contact Material - Mating	Termination	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Post	Operating Temperature [Min]	Operating Temperature [Max]	Contact Material - Post [custom]
Aries Electronics 30-6823-90	1.5 A	0.145 in	3.68 mm	UL94 V-0	30	15	2	0.25 µm	10 µin	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6	Closed Frame	Gold	0.1 in	2.54 mm	Gold	15.24 mm	0.6 in	DIP	Phosphor Bronze	Solder	10 Áin	0.25 çm	Phosphor Bronze
Aries Electronics 30-6823-90C	3 A	0.14 in	3.56 mm	UL94 V-0	30	15	2	0.76 Ám	30 Áin	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Closed Frame	Tin	0.1 in	2.54 mm	Gold	15.24 mm	0.6 in	DIP	Beryllium Copper	Solder	200 µin	5.08 µm		-55 C	105 ░C	Brass