60-9513 Series

Catalog

CONN IC DIP SOCKET 60POS GOLD

Part	Material Flammability Rating	Termination Post Length	Termination Post Length	Current Rating (Amps)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid)	Termination	Contact Finish - Mating	Features	Pitch - Post	Pitch - Post	Mounting Type	Type	Type	Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Post	Pitch - Mating	Pitch - Mating	Housing Material	Operating Temperature [Min]	Operating Temperature [Max]	Contact Material - Mating	Contact Material - Post [custom]
Aries Electronics 60-9513-11H	UL94 V-0	0.125 in	3.18 mm	3 A	30	2	60	Solder	Gold	Closed Frame	0.1 in	2.54 mm	Through Hole	DIP	22.86 mm	0.9 in	0.25 µm	10 µin	10 Áin	0.25 çm	Gold	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	-55 C	105 ░C	Beryllium Copper	Brass
Aries Electronics 60-9513-10	UL94 V-0	0.125 in	3.18 mm	3 A	30	2	60	Solder	Gold	Closed Frame	0.1 in	2.54 mm	Through Hole	DIP	22.86 mm	0.9 in	0.25 µm	10 µin	200 µin	5.08 µm	Tin	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	-55 C	105 ░C	Beryllium Copper	Brass
Aries Electronics 60-9513-10H	UL94 V-0	0.125 in	3.18 mm	3 A	30	2	60	Solder	Gold	Closed Frame	0.1 in	2.54 mm	Through Hole	DIP	22.86 mm	0.9 in	0.25 µm	10 µin	200 µin	5.08 µm	Tin	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	-55 C	105 ░C	Beryllium Copper	Brass
Aries Electronics 60-9513-11	UL94 V-0	0.125 in	3.18 mm	3 A	30	2	60	Solder	Gold	Closed Frame	0.1 in	2.54 mm	Through Hole	DIP	22.86 mm	0.9 in	0.25 µm	10 µin	10 Áin	0.25 çm	Gold	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	-55 C	105 ░C	Beryllium Copper	Brass
Aries Electronics 60-9513-10T	UL94 V-0	0.125 in	3.18 mm	3 A	30	2	60	Solder	Gold	Closed Frame	0.1 in	2.54 mm	Through Hole	DIP	22.86 mm	0.9 in	0.25 µm	10 µin	200 µin	5.08 µm	Tin	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	-55 C	105 ░C	Beryllium Copper	Brass