40-3575 Series

Catalog

CONN IC DIP SOCKET ZIF 40POS GLD

Part	Termination Post Length	Termination Post Length	Material Flammability Rating	Current Rating (Amps)	Contact Finish - Mating	Housing Material	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Features	Number of Positions or Pins (Grid)	Contact Material - Post	Mounting Type	Contact Finish - Post	Type	Type	Type	Termination	Contact Material - Mating	Pitch - Post	Pitch - Post	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post
Aries Electronics 40-3575-16	0.11 in	2.78 mm	UL94 V-0	1 A	Gold	Polyphenylene Sulfide (PPS) Glass Filled	0.25 µm	10 µin	Closed Frame	40	Beryllium Copper	Through Hole	Gold	DIP ZIF (ZIP)	7.62 mm	0.3 in	Solder	Beryllium Copper	0.1 in	2.54 mm	0.1 "	2.54 mm	10 Áin	0.25 çm
Aries Electronics 40-3575-10	0.11 in	2.78 mm	UL94 V-0	1 A	Gold	Polyphenylene Sulfide (PPS) Glass Filled	0.25 µm	10 µin	Closed Frame	40	Beryllium Copper	Through Hole	Gold	DIP ZIF (ZIP)	7.62 mm	0.3 in	Solder	Beryllium Copper	0.1 in	2.54 mm	0.1 "	2.54 mm	10 Áin	0.25 çm
Aries Electronics 40-3575-11	0.11 in	2.78 mm	UL94 V-0	1 A	Gold	Polyphenylene Sulfide (PPS) Glass Filled	0.25 µm	10 µin	Closed Frame	40	Beryllium Copper	Through Hole	Gold	DIP ZIF (ZIP)	7.62 mm	0.3 in	Solder	Beryllium Copper	0.1 in	2.54 mm	0.1 "	2.54 mm	10 Áin	0.25 çm