24-3571 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET ZIF 24POS
| Part | Termination Post Length | Termination Post Length | Material Flammability Rating | Current Rating (Amps) | Housing Material | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Mating | Mounting Type | Termination | Number of Positions or Pins (Grid) [x] | Number of Positions or Pins (Grid) [y] | Number of Positions or Pins (Grid) | Type | Type | Type | Contact Material - Post | Contact Material - Mating | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Post | Features | Pitch - Post | Pitch - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 0.11 in | 2.78 mm | UL94 V-0 | 1 A | Polyphenylene Sulfide (PPS) Glass Filled | 50 µin | 1.27 µm | Nickel Boron | Through Hole | Solder | 12 | 2 | 24 | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | Beryllium Nickel | Beryllium Nickel | 0.1 " | 2.54 mm | 1.27 µm | 50 µin | Nickel Boron | Closed Frame | 0.1 in | 2.54 mm |
Aries Electronics | 0.11 in | 2.78 mm | UL94 V-0 | 1 A | Polyphenylene Sulfide (PPS) Glass Filled | 200 µin | 5.08 µm | Through Hole | Solder | 12 | 2 | 24 | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | Beryllium Copper | Beryllium Copper | 0.1 " | 2.54 mm | 5.08 µm | 200 µin | Tin | Closed Frame | 0.1 in | 2.54 mm | |
Aries Electronics | 0.11 in | 2.78 mm | UL94 V-0 | 1 A | Polyphenylene Sulfide (PPS) Glass Filled | 10 µin | 0.25 µm | Gold | Through Hole | Solder | 12 | 2 | 24 | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | Beryllium Copper | Beryllium Copper | 0.1 " | 2.54 mm | 0.25 çm | 10 Áin | Gold | Closed Frame | 0.1 in | 2.54 mm |