24-3552 Series
Manufacturer: Aries Electronics
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⌘K
CONN IC DIP SOCKET ZIF 24POS TIN
| Part | Termination Post Length | Termination Post Length | Material Flammability Rating | Current Rating (Amps) | Contact Material - Mating | Number of Positions or Pins (Grid) [x] | Number of Positions or Pins (Grid) [y] | Number of Positions or Pins (Grid) | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Post | Type | Type | Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination | Pitch - Post | Pitch - Post | Contact Material - Post | Mounting Type | Features | Housing Material | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 0.11 in | 2.78 mm | UL94 V-0 | 1 A | Beryllium Copper | 12 | 2 | 24 | 0.1 " | 2.54 mm | 200 µin | 5.08 µm | Tin | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | 5.08 µm | 200 µin | Solder | 0.1 in | 2.54 mm | Beryllium Copper | Through Hole | Closed Frame | Polyphenylene Sulfide (PPS) Glass Filled | |
Aries Electronics | 0.11 in | 2.78 mm | UL94 V-0 | 1 A | Beryllium Copper | 12 | 2 | 24 | 0.1 " | 2.54 mm | 50 µin | 1.27 µm | Nickel Boron | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | 1.27 µm | 50 µin | Solder | 0.1 in | 2.54 mm | Beryllium Copper | Through Hole | Closed Frame | Polyphenylene Sulfide (PPS) Glass Filled | Nickel Boron |
Aries Electronics | 0.11 in | 2.78 mm | UL94 V-0 | 1 A | Beryllium Copper | 12 | 2 | 24 | 0.1 " | 2.54 mm | Gold | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | Solder | 0.1 in | 2.54 mm | Beryllium Copper | Through Hole | Closed Frame | Polyphenylene Sulfide (PPS) Glass Filled | Gold |