MPC8000-MMSM-SMT-Capacitors Series

MMSM-Surface-Mount-Capacitors

Catalog

MMSM-Surface-Mount-Capacitors

Part	Package / Case	Operating Temperature [Min]	Operating Temperature [Max]	Capacitance	Size / Dimension [x]	Size / Dimension [y]	Size / Dimension [x]	Size / Dimension [y]	Height - Seated (Max) [Max] [z]	Height - Seated (Max) [Max] [z]	Tolerance	Features	Mounting Type
Microchip Technology MPC8020-206	0402 (1005 Metric)	-55 °C	125 °C	2 pF	1.09 mm	0.023 in	0.043 in	0.58 mm	0.41 mm	0.016 in	10 %	High Q Low Loss RF	Surface Mount
Microchip Technology MPC8050-206	0402 (1005 Metric)	-55 °C	125 °C	5 pF	1.09 mm	0.023 in	0.043 in	0.58 mm	0.41 mm	0.016 in	10 %	High Q Low Loss RF	Surface Mount
Microchip Technology MPC8020-206/TR	0402 (1005 Metric)	-55 °C	125 °C	2 pF	1.09 mm	0.023 in	0.043 in	0.58 mm	0.41 mm	0.016 in	10 %	High Q Low Loss RF	Surface Mount
Microchip Technology MPC8050-206/TR	0402 (1005 Metric)	-55 °C	125 °C	5 pF	1.09 mm	0.023 in	0.043 in	0.58 mm	0.41 mm	0.016 in	10 %	High Q Low Loss RF	Surface Mount

Catalog

MMSM-Surface-Mount-Capacitors

Key Features

• * Low parasitics LP = 0.02nH Typical, CP = 0.04pF Typical

• * Surface Mount design

• * Broadband Performance through X-Band

• * Available on Tape & Reel for automated pick & place assembly

• * Small, SOD 323 Footprint

• * RoHS Compliant

Description

This series of surface mount capacitors utilize new and unique monolithic MMSM® technology. The technology is a package/device integration accomplished at the wafer fabrication level. Since interconnections utilize precision photolithographic techniques rather than wire bonds, parasitic package inductance is tightly controlled. The package parasitics provide smooth non-resonant functionality through X Band.