44-3571 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET ZIF 44POS TIN
| Part | Termination Post Length | Termination Post Length | Material Flammability Rating | Current Rating (Amps) | Contact Finish - Post | Type | Type | Type | Features | Pitch - Mating | Pitch - Mating | Housing Material | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Material - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Mounting Type | Pitch - Post | Pitch - Post | Termination | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 0.11 in | 2.78 mm | UL94 V-0 | 1 A | Tin | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | Closed Frame | 0.1 " | 2.54 mm | Polyphenylene Sulfide (PPS) Glass Filled | 2 22 | 44 | Beryllium Copper | Beryllium Copper | 5.08 µm | 200 µin | 200 µin | 5.08 µm | Through Hole | 0.1 in | 2.54 mm | Solder | |
Aries Electronics | 0.11 in | 2.78 mm | UL94 V-0 | 1 A | Gold | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | Closed Frame | 0.1 " | 2.54 mm | Polyphenylene Sulfide (PPS) Glass Filled | 2 22 | 44 | Beryllium Copper | Beryllium Copper | 0.25 µm | 10 µin | 10 Áin | 0.25 çm | Through Hole | 0.1 in | 2.54 mm | Solder | Gold |
Aries Electronics | 0.11 in | 2.78 mm | UL94 V-0 | 1 A | Nickel Boron | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | Closed Frame | 0.1 " | 2.54 mm | Polyphenylene Sulfide (PPS) Glass Filled | 2 22 | 44 | Beryllium Nickel | Beryllium Nickel | 1.27 µm | 50 µin | 50 µin | 1.27 µm | Through Hole | 0.1 in | 2.54 mm | Solder | Nickel Boron |