M2S060TS Series

Low Density Devices with hard ARM Cortex-M3

Catalog

Low Density Devices with hard ARM Cortex-M3

Part	Supplier Device Package	Grade	Qualification	Operating Temperature [Min]	Operating Temperature [Max]	RAM Size	Peripherals	Core Processor	Connectivity	Architecture	Primary Attributes	Flash Size	Package / Case	Number of I/O	Speed
Microchip Technology M2S060TS-1FGG676T2	676-FBGA (27x27)	Automotive	AEC-Q100	-40 °C	125 ¯C	64 KB	DDR PCIe SERDES	ARM® Cortex®-M3	CANbus Ethernet I2C SPI UART/USART USB	MCU FPGA	FPGA - 60K Logic Modules	256 KB	676-BGA	387	166 MHz
Microchip Technology M2S060TS-VF400	400-VFBGA			0 °C	85 °C	64 KB	DDR PCIe SERDES	ARM® Cortex®-M3	CANbus Ethernet I2C SPI UART/USART USB	MCU FPGA	FPGA - 60K Logic Modules	256 KB	400-LFBGA	207	166 MHz
Microchip Technology M2S060TS-1VF400	400-VFBGA			0 °C	85 °C	64 KB	DDR PCIe SERDES	ARM® Cortex®-M3	CANbus Ethernet I2C SPI UART/USART USB	MCU FPGA	FPGA - 60K Logic Modules	256 KB	400-LFBGA	207	166 MHz
Microchip Technology M2S060-1FG676	676-FBGA (27x27)			0 °C	85 °C	64 KB	DDR PCIe SERDES	ARM® Cortex®-M3	CANbus Ethernet I2C SPI UART/USART USB	MCU FPGA	FPGA - 60K Logic Modules	256 KB	676-BGA	387	166 MHz
Microchip Technology M2S060-FCS325	325-FCBGA (11x11)			0 °C	85 °C	64 KB	DDR PCIe SERDES	ARM® Cortex®-M3	CANbus Ethernet I2C SPI UART/USART USB	MCU FPGA	FPGA - 60K Logic Modules	256 KB	325-TFBGA FCBGA	200	166 MHz
Microchip Technology M2S060-1FG676I	676-FBGA (27x27)			-40 C	100 °C	64 KB	DDR PCIe SERDES	ARM® Cortex®-M3	CANbus Ethernet I2C SPI UART/USART USB	MCU FPGA	FPGA - 60K Logic Modules	256 KB	676-BGA	387	166 MHz
Microchip Technology M2S060TS-FCS325I	325-FCBGA (11x11)			-40 C	100 °C	64 KB	DDR PCIe SERDES	ARM® Cortex®-M3	CANbus Ethernet I2C SPI UART/USART USB	MCU FPGA	FPGA - 60K Logic Modules	256 KB	325-TFBGA FCBGA	200	166 MHz
Microchip Technology M2S060T-1FG484M	484-FPBGA (23x23)			-55 °C	125 ¯C	64 KB	DDR PCIe SERDES	ARM® Cortex®-M3	CANbus Ethernet I2C SPI UART/USART USB	MCU FPGA	FPGA - 60K Logic Modules	256 KB	484-BGA	267 I/O	166 MHz
Microchip Technology M2S060TS-FCS325	325-FCBGA (11x11)			0 °C	85 °C	64 KB	DDR PCIe SERDES	ARM® Cortex®-M3	CANbus Ethernet I2C SPI UART/USART USB	MCU FPGA	FPGA - 60K Logic Modules	256 KB	325-TFBGA FCBGA	200	166 MHz
Microchip Technology M2S060-FG484I	484-FPBGA (23x23)			-40 C	100 °C	64 KB	DDR PCIe SERDES	ARM® Cortex®-M3	CANbus Ethernet I2C SPI UART/USART USB	MCU FPGA	FPGA - 60K Logic Modules	256 KB	484-BGA	267 I/O	166 MHz

Catalog

Low Density Devices with hard ARM Cortex-M3

Key Features

• Microcontroller Subsystem* Hard 166-MHz 32-Bit ARM Cortex-M3 based SoC FPGA

• * 1.25 DMIPS/MHz

• * 256 KB embedded nonvolatile memory (eNVM)

• * Triple-speed Ethernet (TSE) 10/100/1000 Mbps MAC

• * USB 2.0 high speed on-the-go (OTG) controller

• * 2.0B-compliant CAN controller

• * 64 KB embedded SRAM (eSRAM)

• * Two SPI ports, two I2C ports, and multi-mode UARTs

•

• FPGA Fabric* 56.5K logic elements

• * 72 Math blocks (18x18)

• * AES256, SHA256, RNG

• * ECC, PUF

• * 6 PLLs and CCCs

• * 1314K bits RAM

• * 1 DDR Controller - LPDDR/DDR2/3

• * 4 SERDES Lanes

• * 2 PCIe End Points

• * Offers design security

• * Temperature - Commercial, Industrial, Automotive (T2), Military

Description

These flash FPGA devices are ideal for general purpose functions such as Gigabit Ethernet or dual PCI Express control planes, bridging functions, input/output (I/O) expansion and conversion, video/image processing, system management and secure connectivity. Microchip FPGAs are used by customers in Communications, Industrial, Medical, Defense, and Aviation markets. More Resources in Low Density Devices • ARM Cortex-M3 Processor with embedded flash • Comprehensive microcontroller subsystem • PCIe Gen2 support With Clear Advantages • Lowest Power • Reduce total power by ~20-40% • 70mW per 5G SERDES (PCIe Gen2) • Proven Security • Protection from Overbuilding and Cloning • Secure Boot for FPGA & Processors • Exceptional Reliability • SEU immune Zero FIT Flash FPGA Configuration • Reliability safety critical and mission critical systems