CSD22205L Series

-8V, P channel NexFET™ power MOSFET, single LGA 1.2 mm x 1.2 mm, 9.9 mOhm, gate ESD protection

Catalog

-8V, P channel NexFET™ power MOSFET, single LGA 1.2 mm x 1.2 mm, 9.9 mOhm, gate ESD protection

Part	Vgs(th) (Max) @ Id	Input Capacitance (Ciss) (Max) @ Vds	Rds On (Max) @ Id, Vgs	Package / Case	Vgs (Max) [Max]	Drive Voltage (Max Rds On, Min Rds On)	Mounting Type	Gate Charge (Qg) (Max) @ Vgs	FET Type	Current - Continuous Drain (Id) @ 25°C	Supplier Device Package	Drain to Source Voltage (Vdss)	Power Dissipation (Max) [Max]	Technology	Operating Temperature [Min]	Operating Temperature [Max]
Texas Instruments CSD22205LT	1.05 V	1390 pF	9.9 mOhm	4-XFLGA	-6 V	1.5 V 4.5 V	Surface Mount	8.5 nC	P-Channel	7.4 A	4-PICOSTAR	8 V	600 mW	MOSFET (Metal Oxide)	-55 °C	150 °C
Texas Instruments CSD22205L	1.05 V	1390 pF	9.9 mOhm	4-XFLGA	-6 V	1.5 V 4.5 V	Surface Mount	8.5 nC	P-Channel	7.4 A	4-PICOSTAR	8 V	600 mW	MOSFET (Metal Oxide)	-55 °C	150 °C

Catalog

-8V, P channel NexFET™ power MOSFET, single LGA 1.2 mm x 1.2 mm, 9.9 mOhm, gate ESD protection

Key Features

• Low resistanceSmall footprint 1.2 mm × 1.2 mmLow profile 0.36-mm heightLead freeGate-source voltage clampGate ESD protectionRoHS compliantHalogen freeLow resistanceSmall footprint 1.2 mm × 1.2 mmLow profile 0.36-mm heightLead freeGate-source voltage clampGate ESD protectionRoHS compliantHalogen free

Description

This –8-V, 8.2-mΩ, 1.2-mm × 1.2-mm Land Grid Array (LGA) NexFET™ device has been designed to deliver the lowest on-resistance and gate charge in the smallest outline possible with excellent thermal characteristics in an ultra-low profile. The Land Grid Array (LGA) package is a silicon chip scale package with metal pads instead of solder balls. This –8-V, 8.2-mΩ, 1.2-mm × 1.2-mm Land Grid Array (LGA) NexFET™ device has been designed to deliver the lowest on-resistance and gate charge in the smallest outline possible with excellent thermal characteristics in an ultra-low profile. The Land Grid Array (LGA) package is a silicon chip scale package with metal pads instead of solder balls.