32-6572 Series

Catalog

CONN IC DIP SOCKET ZIF 32POS TIN

Part	Termination Post Length	Termination Post Length	Material Flammability Rating	Current Rating (Amps)	Contact Material - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Features	Mounting Type	Contact Finish - Post	Termination	Pitch - Mating	Pitch - Mating	Housing Material	Type	Type	Pitch - Post	Pitch - Post	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating
Aries Electronics 32-6572-16	0.11 in	2.78 mm	UL94 V-0	1 A	Beryllium Copper	200 µin	5.08 µm	Closed Frame	Through Hole	Tin	Solder	0.1 "	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	0.1 in	2.54 mm	32	Beryllium Copper	5.08 µm	200 µin
Aries Electronics 32-6572-10	0.11 in	2.78 mm	UL94 V-0	1 A	Beryllium Copper	200 µin	5.08 µm	Closed Frame	Through Hole	Tin	Solder	0.1 "	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	0.1 in	2.54 mm	32	Beryllium Copper	5.08 µm	200 µin