628-40 Series
Manufacturer: Wakefield Thermal Solutions
OMNIDIRECTIONAL PIN FIN HEAT SINK FOR 45MM BGA ROHS COMPLIANT: YES
| Part | Power Dissipation @ Temperature Rise | Length | Length | Material | Width [x] | Width [x] | Type | Fin Height [z] | Fin Height [z] | Attachment Method | Material Finish | Shape | Package Cooled | Thermal Resistance @ Forced Air Flow |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Wakefield Thermal Solutions | 2.5 W 30 °C | 1.75 in | 44.45 mm | Aluminum | 1.7 in | 43.18 mm | Top Mount | 4 in | 101.6 mm | Thermal Tape Adhesive (Included) | Black Anodized | Pin Fins Square | ASIC BGA CPU LGA | 4 °C/W |
Wakefield Thermal Solutions | 2.5 W 30 °C | 1.75 in | 44.45 mm | Aluminum | 1.7 in | 43.18 mm | Top Mount | 4 in | 101.6 mm | Thermal Tape Adhesive (Included) | Black Anodized | Pin Fins Square | ASIC BGA CPU LGA | 4 °C/W |
Wakefield Thermal Solutions | 2.5 W 30 °C | 1.75 in | 44.45 mm | Aluminum | 1.7 in | 43.18 mm | Top Mount | 0.4 in | 10.16 mm | Thermal Tape Adhesive | Black Anodized | Pin Fins Square | ASIC BGA CPU LGA | 4 °C/W |
Wakefield Thermal Solutions | 2.5 W 30 °C | 1.75 in | 44.45 mm | Aluminum | 1.7 in | 43.18 mm | Top Mount | 0.4 in | 10.16 mm | Thermal Tape Adhesive | Black Anodized | Pin Fins Square | ASIC BGA CPU LGA | 4 °C/W |
Wakefield Thermal Solutions | 2.5 W 30 °C | 1.75 in | 44.45 mm | Aluminum | 1.7 in | 43.18 mm | Top Mount | 4 in | 101.6 mm | Thermal Tape Adhesive (Included) | Black Anodized | Pin Fins Square | ASIC BGA CPU LGA | 4 °C/W |
Wakefield Thermal Solutions | 2.5 W 30 °C | 1.75 in | 44.45 mm | Aluminum | 1.7 in | 43.18 mm | Top Mount | 4 in | 101.6 mm | Thermal Tape Adhesive (Included) | Black Anodized | Pin Fins Square | ASIC BGA CPU LGA | 4 °C/W |