28-6554 Series

Catalog

CONN IC DIP SOCKET ZIF 28POS

Part	Material Flammability Rating	Current Rating (Amps)	Termination Post Length	Termination Post Length	Contact Material - Mating	Housing Material	Pitch - Post	Pitch - Post	Contact Material - Post	Pitch - Mating	Pitch - Mating	Features	Termination	Mounting Type	Type	Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Contact Finish - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Post	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 28-6554-16	UL94 V-0	1 A	0.11 in	2.78 mm	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	Beryllium Copper	0.1 "	2.54 mm	Closed Frame	Solder	Through Hole	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	50 µin	1.27 µm	28	Nickel Boron	1.27 µm	50 µin	Nickel Boron
Aries Electronics 28-6554-10	UL94 V-0	1 A	0.11 in	2.78 mm	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	Beryllium Copper	0.1 "	2.54 mm	Closed Frame	Solder	Through Hole	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	200 µin	5.08 µm	28		5.08 µm	200 µin	Tin
Aries Electronics 28-6554-18	UL94 V-0	1 A	0.11 in	2.78 mm	Beryllium Nickel	Polyetheretherketone (PEEK) Glass Filled	0.1 in	2.54 mm	Beryllium Nickel	0.1 "	2.54 mm	Closed Frame	Solder	Through Hole	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	50 µin	1.27 µm	28	Nickel Boron	1.27 µm	50 µin	Nickel Boron	-55 C	250 °C