33-0518 Series

Catalog

CONN SOCKET SIP 33POS GOLD

Part	Current Rating (Amps)	Termination Post Length	Termination Post Length	Material Flammability Rating	Pitch - Mating	Pitch - Mating	Contact Material - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Mating	Housing Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Features	Mounting Type	Number of Positions or Pins (Grid)	Contact Finish - Post	Termination	Contact Material - Post [custom]	Pitch - Post	Pitch - Post	Type
Aries Electronics 33-0518-00	3 A	1.17 mm	0.046 in	UL94 V-0	0.1 "	2.54 mm	Beryllium Copper	0.25 µm	10 µin	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	200 µin	5.08 µm	Open Frame	Surface Mount	33	Tin	Solder	Brass	0.1 in	2.54 mm	SIP
Aries Electronics 33-0518-10H	3 A	3.18 mm	0.125 in	UL94 V-0	0.1 "	2.54 mm	Beryllium Copper	0.25 µm	10 µin	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	200 µin	5.08 µm	Open Frame	Through Hole	33	Tin	Solder	Brass	0.1 in	2.54 mm	SIP
Aries Electronics 33-0518-11	3 A	3.18 mm	0.125 in	UL94 V-0	0.1 "	2.54 mm	Beryllium Copper	0.25 µm	10 µin	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	10 Áin	0.25 çm	Open Frame	Through Hole	33	Gold	Solder	Brass	0.1 in	2.54 mm	SIP
Aries Electronics 33-0518-10	3 A	3.18 mm	0.125 in	UL94 V-0	0.1 "	2.54 mm	Beryllium Copper	0.25 µm	10 µin	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	200 µin	5.08 µm	Open Frame	Through Hole	33	Tin	Solder	Brass	0.1 in	2.54 mm	SIP
Aries Electronics 33-0518-11H	3 A	3.18 mm	0.125 in	UL94 V-0	0.1 "	2.54 mm	Beryllium Copper	0.25 µm	10 µin	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	10 Áin	0.25 çm	Open Frame	Through Hole	33	Gold	Solder	Brass	0.1 in	2.54 mm	SIP