24-6570 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET ZIF 24POS
| Part | Termination Post Length | Termination Post Length | Material Flammability Rating | Current Rating (Amps) | Contact Finish - Mating | Contact Finish - Post | Mounting Type | Housing Material | Termination | Pitch - Post | Pitch - Post | Number of Positions or Pins (Grid) [x] | Number of Positions or Pins (Grid) [y] | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Features | Type | Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 0.11 in | 2.78 mm | UL94 V-0 | 1 A | Nickel Boron | Nickel Boron | Through Hole | Polyphenylene Sulfide (PPS) Glass Filled | Solder | 0.1 in | 2.54 mm | 12 | 2 | 24 | Beryllium Nickel | 0.1 " | 2.54 mm | 50 µin | 1.27 µm | Closed Frame | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | 1.27 µm | 50 µin | Beryllium Nickel |
Aries Electronics | 0.11 in | 2.78 mm | UL94 V-0 | 1 A | Nickel Boron | Nickel Boron | Through Hole | Polyphenylene Sulfide (PPS) Glass Filled | Solder | 0.1 in | 2.54 mm | 12 | 2 | 24 | Beryllium Nickel | 0.1 " | 2.54 mm | 50 µin | 1.27 µm | Closed Frame | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | 1.27 µm | 50 µin | Beryllium Nickel |