32-C300 Series

Catalog

CONN IC DIP SOCKET 32POS GOLD

Part	Current Rating (Amps)	Material Flammability Rating	Termination Post Length	Termination Post Length	Contact Finish - Post	Pitch - Post	Pitch - Post	Pitch - Mating	Pitch - Mating	Housing Material	Contact Material - Post [custom]	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Mounting Type	Contact Material - Mating	Type [custom]	Type [custom]	Type	Termination	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Positions or Pins (Grid)	Operating Temperature [Min]	Operating Temperature [Max]	Features
Aries Electronics 32-C300-30	3 A	UL94 V-0	0.04 in	1.02 mm	Tin	0.1 in	2.54 mm	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Brass	Gold	0.25 µm	10 µin	Through Hole	Beryllium Copper	15.24 mm	0.6 in	DIP	Wire Wrap	200 µin	5.08 µm	32	-55 C	105 ░C	Closed Frame
Aries Electronics 32-C300-10	3 A	UL94 V-0	0.125 in	3.18 mm	Tin	0.1 in	2.54 mm	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Brass	Gold	0.25 µm	10 µin	Through Hole	Beryllium Copper	15.24 mm	0.6 in	DIP	Solder	200 µin	5.08 µm	32	-55 C	105 ░C	Closed Frame
Aries Electronics 32-C300-20	3 A	UL94 V-0	0.04 in	1.02 mm	Tin	0.1 in	2.54 mm	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Brass	Gold	0.25 µm	10 µin	Through Hole	Beryllium Copper	15.24 mm	0.6 in	DIP	Wire Wrap	200 µin	5.08 µm	32	-55 C	105 ░C	Closed Frame
Aries Electronics 32-C300-11	3 A	UL94 V-0	0.125 in	3.18 mm	Gold	0.1 in	2.54 mm	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Brass	Gold	0.25 µm	10 µin	Through Hole	Beryllium Copper	15.24 mm	0.6 in	DIP	Solder	10 Áin	0.25 çm	32	-55 C	125 °C	Closed Frame
Aries Electronics 32-C300-31	3 A	UL94 V-0	0.04 in	1.02 mm	Gold	0.1 in	2.54 mm	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Brass	Gold	0.25 µm	10 µin	Through Hole	Beryllium Copper	15.24 mm	0.6 in	DIP	Wire Wrap	10 Áin	0.25 çm	32	-55 C	125 °C	Closed Frame
Aries Electronics 32-C300-00	3 A	UL94 V-0	0.04 in	1.02 mm	Tin	0.1 in	2.54 mm	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Brass	Gold	0.25 µm	10 µin	Surface Mount	Beryllium Copper	15.24 mm	0.6 in	DIP	Solder	200 µin	5.08 µm	32	-55 C	105 ░C	Closed Frame