WAVE-45 Series
Manufacturer: Wakefield Thermal Solutions
LOW PROFILE HEAT SINK BGA CHIPSET ALUMINUM TOP MOUNT ROHS COMPLIANT: YES
| Part | Package Cooled | Material | Type | Thermal Resistance @ Forced Air Flow | Fin Height | Fin Height | Length [x] | Length [x] | Material Finish | Shape [custom] | Shape [custom] | Attachment Method | Width | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Wakefield Thermal Solutions | BGA | Aluminum Alloy | Board Level | 2.96 °C/W | 0.472 in | 12 mm | 1.772 in | 45 mm | Black Anodized | Angled Fins | Square | Clip | 1.772 in | 45 mm |
Wakefield Thermal Solutions | BGA | Aluminum Alloy | Board Level | 2.96 °C/W | 0.472 in | 12 mm | 1.772 in | 45 mm | Black Anodized | Angled Fins | Square | Clip | 1.772 in | 45 mm |