44-3552 Series

Catalog

CONN IC DIP SOCKET ZIF 44POS

Part	Material Flammability Rating	Termination Post Length	Termination Post Length	Current Rating (Amps)	Pitch - Post	Pitch - Post	Termination	Type	Type	Type	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid)	Features	Contact Finish - Mating	Housing Material	Contact Material - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Pitch - Mating	Pitch - Mating	Mounting Type	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 44-3552-16	UL94 V-0	0.11 in	2.78 mm	1 A	0.1 in	2.54 mm	Solder	DIP ZIF (ZIP)	7.62 mm	0.3 in	2 22	44	Closed Frame	Nickel Boron	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	Nickel Boron	1.27 µm	50 µin	50 µin	1.27 µm	Beryllium Copper	0.1 "	2.54 mm	Through Hole
Aries Electronics 44-3552-10	UL94 V-0	0.11 in	2.78 mm	1 A	0.1 in	2.54 mm	Solder	DIP ZIF (ZIP)	7.62 mm	0.3 in	2 22	44	Closed Frame		Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	Tin	5.08 µm	200 µin	200 µin	5.08 µm	Beryllium Copper	0.1 "	2.54 mm	Through Hole
Aries Electronics 44-3552-18	UL94 V-0	0.11 in	2.78 mm	1 A	0.1 in	2.54 mm	Solder	DIP ZIF (ZIP)	7.62 mm	0.3 in	2 22	44	Closed Frame	Nickel Boron	Polyetheretherketone (PEEK) Glass Filled	Beryllium Nickel	Nickel Boron	1.27 µm	50 µin	50 µin	1.27 µm	Beryllium Nickel	0.1 "	2.54 mm	Through Hole	-55 C	250 °C
Aries Electronics 44-3552-11	UL94 V-0	0.11 in	2.78 mm	1 A	0.1 in	2.54 mm	Solder	DIP ZIF (ZIP)	7.62 mm	0.3 in	2 22	44	Closed Frame	Gold	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	Gold					Beryllium Copper	0.1 "	2.54 mm	Through Hole