26-0518 Series

Catalog

CONN SOCKET SIP 26POS GOLD

Part	Termination Post Length	Termination Post Length	Material Flammability Rating	Current Rating (Amps)	Mounting Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Post	Pitch - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Type	Features	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Housing Material	Contact Finish - Mating	Contact Finish - Post	Contact Material - Mating	Termination	Contact Material - Post [custom]
Aries Electronics 26-0518-11H	0.125 in	3.18 mm	UL94 V-0	3 A	Through Hole	0.25 µm	10 µin	0.1 in	2.54 mm	10 Áin	0.25 çm	SIP	Open Frame	0.1 "	2.54 mm	1	26	26	Polyamide (PA46) Nylon 4/6 Glass Filled	Gold	Gold	Beryllium Copper	Solder	Brass
Aries Electronics 26-0518-10T	0.125 in	3.18 mm	UL94 V-0	3 A	Through Hole	0.25 µm	10 µin	0.1 in	2.54 mm	200 µin	5.08 µm	SIP	Open Frame	0.1 "	2.54 mm	1	26	26	Polyamide (PA46) Nylon 4/6 Glass Filled	Gold	Tin	Beryllium Copper	Solder	Brass
Aries Electronics 26-0518-10H	0.125 in	3.18 mm	UL94 V-0	3 A	Through Hole	0.25 µm	10 µin	0.1 in	2.54 mm	200 µin	5.08 µm	SIP	Open Frame	0.1 "	2.54 mm	1	26	26	Polyamide (PA46) Nylon 4/6 Glass Filled	Gold	Tin	Beryllium Copper	Solder	Brass
Aries Electronics 26-0518-00	0.046 in	1.17 mm	UL94 V-0	3 A	Surface Mount	0.25 µm	10 µin	0.1 in	2.54 mm	200 µin	5.08 µm	SIP	Open Frame	0.1 "	2.54 mm	1	26	26	Polyamide (PA46) Nylon 4/6 Glass Filled	Gold	Tin	Beryllium Copper	Solder	Brass
Aries Electronics 26-0518-10	0.125 in	3.18 mm	UL94 V-0	3 A	Through Hole	0.25 µm	10 µin	0.1 in	2.54 mm	200 µin	5.08 µm	SIP	Open Frame	0.1 "	2.54 mm	1	26	26	Polyamide (PA46) Nylon 4/6 Glass Filled	Gold	Tin	Beryllium Copper	Solder	Brass