18-823 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET 18POS GOLD
| Part | Termination Post Length | Termination Post Length | Current Rating (Amps) | Material Flammability Rating | Contact Material - Mating | Pitch - Post | Pitch - Post | Termination | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Operating Temperature [Min] | Operating Temperature [Max] | Type | Type | Type | Contact Material - Post | Number of Positions or Pins (Grid) | Housing Material | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Features | Contact Finish - Mating | Contact Finish - Post | Contact Material - Post [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 0.145 in | 3.68 mm | 1.5 A | UL94 V-0 | Phosphor Bronze | 0.1 in | 2.54 mm | Solder | 0.1 " | 2.54 mm | 10 Áin | 0.25 çm | -55 C | 105 ░C | 7.62 mm | 0.3 in | DIP | Phosphor Bronze | 18 | Polyamide (PA46) Nylon 4/6 | 0.25 µm | 10 µin | Closed Frame | Gold | Gold | |
Aries Electronics | 0.145 in | 3.68 mm | 1.5 A | UL94 V-0 | Phosphor Bronze | 0.1 in | 2.54 mm | Solder | 0.1 " | 2.54 mm | 200 µin | 5.08 µm | -55 C | 105 ░C | 7.62 mm | 0.3 in | DIP | Phosphor Bronze | 18 | Polyamide (PA46) Nylon 4/6 | 5.08 µm | 200 µin | Closed Frame | Tin | ||
Aries Electronics | 0.14 in | 3.56 mm | 3 A | UL94 V-0 | Beryllium Copper | 0.1 in | 2.54 mm | Solder | 0.1 " | 2.54 mm | 200 µin | 5.08 µm | -55 C | 105 ░C | 7.62 mm | 0.3 in | DIP | 18 | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.76 Ám | 30 Áin | Closed Frame | Gold | Tin | Brass |