28-6552 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET ZIF 28POS
| Part | Current Rating (Amps) | Material Flammability Rating | Termination Post Length | Termination Post Length | Contact Finish - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Post | Pitch - Post | Number of Positions or Pins (Grid) | Mounting Type | Housing Material | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Pitch - Mating | Pitch - Mating | Contact Material - Mating | Contact Material - Post | Type | Type | Termination | Features |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 1 A | UL94 V-0 | 0.11 in | 2.78 mm | Nickel Boron | -55 C | 250 °C | Nickel Boron | 50 µin | 1.27 µm | 0.1 in | 2.54 mm | 28 | Through Hole | Polyetheretherketone (PEEK) Glass Filled | 1.27 µm | 50 µin | 0.1 " | 2.54 mm | Beryllium Nickel | Beryllium Nickel | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | Solder | Closed Frame |
Aries Electronics | 1 A | UL94 V-0 | 0.11 in | 2.78 mm | Nickel Boron | Nickel Boron | 50 µin | 1.27 µm | 0.1 in | 2.54 mm | 28 | Through Hole | Polyphenylene Sulfide (PPS) Glass Filled | 1.27 µm | 50 µin | 0.1 " | 2.54 mm | Beryllium Copper | Beryllium Copper | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | Solder | Closed Frame |