44-6553 Series

Catalog

CONN IC DIP SOCKET ZIF 44POS

Part	Material Flammability Rating	Termination Post Length	Termination Post Length	Current Rating (Amps)	Type	Type	Termination	Contact Material - Mating	Mounting Type	Pitch - Post	Pitch - Post	Contact Finish - Mating	Housing Material	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid)	Contact Material - Post	Contact Finish - Post	Operating Temperature [Min]	Operating Temperature [Max]	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post
Aries Electronics 44-6553-18	UL94 V-0	0.11 in	2.78 mm	1 A	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Solder	Beryllium Nickel	Through Hole	0.1 in	2.54 mm	Nickel Boron	Polyetheretherketone (PEEK) Glass Filled	2 22	44	Beryllium Nickel	Nickel Boron	-55 C	250 °C	Closed Frame	50 µin	1.27 µm	0.1 "	2.54 mm	1.27 µm	50 µin
Aries Electronics 44-6553-16	UL94 V-0	0.11 in	2.78 mm	1 A	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Solder	Beryllium Copper	Through Hole	0.1 in	2.54 mm	Nickel Boron	Polyphenylene Sulfide (PPS) Glass Filled	2 22	44	Beryllium Copper	Nickel Boron			Closed Frame	50 µin	1.27 µm	0.1 "	2.54 mm	1.27 µm	50 µin
Aries Electronics 44-6553-10	UL94 V-0	0.11 in	2.78 mm	1 A	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Solder	Beryllium Copper	Through Hole	0.1 in	2.54 mm		Polyphenylene Sulfide (PPS) Glass Filled	2 22	44	Beryllium Copper	Tin			Closed Frame	200 µin	5.08 µm	0.1 "	2.54 mm	5.08 µm	200 µin
Aries Electronics 44-6553-11	UL94 V-0	0.11 in	2.78 mm	1 A	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Solder	Beryllium Copper	Through Hole	0.1 in	2.54 mm	Gold	Polyphenylene Sulfide (PPS) Glass Filled	2 22	44	Beryllium Copper	Gold			Closed Frame			0.1 "	2.54 mm