630-60 Series
Manufacturer: Wakefield Thermal Solutions
HEATSINK FOR 35MM BGA
| Part | Shape | Package Cooled | Type | Attachment Method | Material | Thermal Resistance @ Forced Air Flow | Length [x] | Length | Material Finish | Fin Height | Fin Height | Width [y] | Width [y] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Wakefield Thermal Solutions | Pin Fins Square | BGA | Top Mount | Thermal Tape Adhesive | Aluminum | 3 °C/W | 1.378 " | 35 mm | Black Anodized | 15.24 mm | 0.6 in | 1.378 " | 35 mm |
Wakefield Thermal Solutions | Pin Fins Square | BGA | Top Mount | Thermal Tape Adhesive | Aluminum | 3 °C/W | 1.378 " | 35 mm | Black Anodized | 15.24 mm | 0.6 in | 1.378 " | 35 mm |
Wakefield Thermal Solutions | Pin Fins Square | BGA | Top Mount | Thermal Tape Adhesive | Aluminum | 3 °C/W | 1.378 " | 35 mm | Black Anodized | 15.24 mm | 0.6 in | 1.378 " | 35 mm |
Wakefield Thermal Solutions | Pin Fins Square | BGA | Top Mount | Thermal Tape Adhesive | Aluminum | 3 °C/W | 1.378 " | 35 mm | Black Anodized | 15.24 mm | 0.6 in | 1.378 " | 35 mm |