144-PGM Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN SOCKET PGA GOLD
| Part | Current Rating (Amps) | Material Flammability Rating | Termination Post Length | Termination Post Length | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination | Operating Temperature [Min] | Operating Temperature [Max] | Contact Material - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Type | Mounting Type | Contact Finish - Post | Contact Finish - Mating | Pitch - Post | Pitch - Post | Contact Material - Post [custom] | Housing Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 3 A | UL94 V-0 | 4.19 mm | 0.165 " | 0.1 " | 2.54 mm | 0.25 µm | 10 µin | Solder | -55 C | 105 ░C | Beryllium Copper | 200 µin | 5.08 µm | PGA | Through Hole | Tin | Gold | 0.1 in | 2.54 mm | Brass | Polyamide (PA46) Nylon 4/6 Glass Filled |
Aries Electronics | 3 A | UL94 V-0 | 4.19 mm | 0.165 " | 0.1 " | 2.54 mm | 0.25 µm | 10 µin | Solder | -55 C | 125 °C | Beryllium Copper | 10 Áin | 0.25 çm | PGA | Through Hole | Gold | Gold | 0.1 in | 2.54 mm | Brass | Polyamide (PA46) Nylon 4/6 Glass Filled |
Aries Electronics | 3 A | UL94 V-0 | 4.19 mm | 0.165 " | 0.1 " | 2.54 mm | 0.25 µm | 10 µin | Solder | -55 C | 125 °C | Beryllium Copper | 10 Áin | 0.25 çm | PGA | Through Hole | Gold | Gold | 0.1 in | 2.54 mm | Brass | Polyamide (PA46) Nylon 4/6 Glass Filled |
Aries Electronics | 3 A | UL94 V-0 | 4.19 mm | 0.165 " | 0.1 " | 2.54 mm | 0.25 µm | 10 µin | Solder | -55 C | 125 °C | Beryllium Copper | 10 Áin | 0.25 çm | PGA | Through Hole | Gold | Gold | 0.1 in | 2.54 mm | Brass | Polyamide (PA46) Nylon 4/6 Glass Filled |
Aries Electronics | 3 A | UL94 V-0 | 4.19 mm | 0.165 " | 0.1 " | 2.54 mm | 0.25 µm | 10 µin | Solder | -55 C | 105 ░C | Beryllium Copper | 200 µin | 5.08 µm | PGA | Through Hole | Tin | Gold | 0.1 in | 2.54 mm | Brass | Polyamide (PA46) Nylon 4/6 Glass Filled |