44-3553 Series

Catalog

CONN IC DIP SOCKET ZIF 44POS

Part	Termination Post Length	Termination Post Length	Current Rating (Amps)	Material Flammability Rating	Type	Type	Type	Pitch - Mating	Pitch - Mating	Termination	Contact Finish - Post	Pitch - Post	Pitch - Post	Contact Material - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Mating	Features	Housing Material	Contact Material - Mating	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid)	Mounting Type	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 44-3553-16	0.11 in	2.78 mm	1 A	UL94 V-0	DIP ZIF (ZIP)	7.62 mm	0.3 in	0.1 "	2.54 mm	Solder	Nickel Boron	0.1 in	2.54 mm	Beryllium Copper	1.27 µm	50 µin	50 µin	1.27 µm	Nickel Boron	Closed Frame	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	2 22	44	Through Hole
Aries Electronics 44-3553-11	0.11 in	2.78 mm	1 A	UL94 V-0	DIP ZIF (ZIP)	7.62 mm	0.3 in	0.1 "	2.54 mm	Solder	Gold	0.1 in	2.54 mm	Beryllium Copper					Gold	Closed Frame	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	2 22	44	Through Hole
Aries Electronics 44-3553-18	0.11 in	2.78 mm	1 A	UL94 V-0	DIP ZIF (ZIP)	7.62 mm	0.3 in	0.1 "	2.54 mm	Solder	Nickel Boron	0.1 in	2.54 mm	Beryllium Nickel	1.27 µm	50 µin	50 µin	1.27 µm	Nickel Boron	Closed Frame	Polyetheretherketone (PEEK) Glass Filled	Beryllium Nickel	2 22	44	Through Hole	-55 C	250 °C
Aries Electronics 44-3553-10	0.11 in	2.78 mm	1 A	UL94 V-0	DIP ZIF (ZIP)	7.62 mm	0.3 in	0.1 "	2.54 mm	Solder	Tin	0.1 in	2.54 mm	Beryllium Copper	5.08 µm	200 µin	200 µin	5.08 µm		Closed Frame	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	2 22	44	Through Hole