32-3553 Series

Catalog

CONN IC DIP SOCKET ZIF 32POS

Part	Termination Post Length	Termination Post Length	Current Rating (Amps)	Material Flammability Rating	Features	Type	Type	Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Mating	Pitch - Mating	Contact Finish - Post	Number of Positions or Pins (Grid)	Contact Material - Post	Pitch - Post	Pitch - Post	Contact Material - Mating	Housing Material	Termination	Mounting Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Mating	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 32-3553-16	0.11 in	2.78 mm	1 A	UL94 V-0	Closed Frame	DIP ZIF (ZIP)	7.62 mm	0.3 in	1.27 µm	50 µin	0.1 "	2.54 mm	Nickel Boron	32	Beryllium Copper	0.1 in	2.54 mm	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	Solder	Through Hole	50 µin	1.27 µm	Nickel Boron
Aries Electronics 32-3553-18	0.11 in	2.78 mm	1 A	UL94 V-0	Closed Frame	DIP ZIF (ZIP)	7.62 mm	0.3 in	1.27 µm	50 µin	0.1 "	2.54 mm	Nickel Boron	32	Beryllium Nickel	0.1 in	2.54 mm	Beryllium Nickel	Polyetheretherketone (PEEK) Glass Filled	Solder	Through Hole	50 µin	1.27 µm	Nickel Boron	-55 C	250 °C
Aries Electronics 32-3553-10	0.11 in	2.78 mm	1 A	UL94 V-0	Closed Frame	DIP ZIF (ZIP)	7.62 mm	0.3 in	5.08 µm	200 µin	0.1 "	2.54 mm	Tin	32	Beryllium Copper	0.1 in	2.54 mm	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	Solder	Through Hole	200 µin	5.08 µm