48-6554 Series
Manufacturer: Aries Electronics
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CONN IC DIP SOCKET ZIF 48POS GLD
| Part | Material Flammability Rating | Termination Post Length | Termination Post Length | Current Rating (Amps) | Termination | Mounting Type | Features | Number of Positions or Pins (Grid) [y] | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [x] | Housing Material | Pitch - Mating | Pitch - Mating | Contact Material - Post | Contact Finish - Mating | Pitch - Post | Pitch - Post | Type | Type | Contact Material - Mating | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Operating Temperature [Min] | Operating Temperature [Max] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | UL94 V-0 | 0.11 in | 2.78 mm | 1 A | Solder | Through Hole | Closed Frame | 2 | 48 | 24 | Polyphenylene Sulfide (PPS) Glass Filled | 0.1 " | 2.54 mm | Beryllium Copper | Gold | 0.1 in | 2.54 mm | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | Beryllium Copper | Gold | ||||||
 Aries Electronics | UL94 V-0 | 0.11 in | 2.78 mm | 1 A | Solder | Through Hole | Closed Frame | 2 | 48 | 24 | Polyphenylene Sulfide (PPS) Glass Filled | 0.1 " | 2.54 mm | Beryllium Copper | Nickel Boron | 0.1 in | 2.54 mm | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | Beryllium Copper | Nickel Boron | 50 µin | 1.27 µm | 1.27 µm | 50 µin | ||
Aries Electronics | UL94 V-0 | 0.11 in | 2.78 mm | 1 A | Solder | Through Hole | Closed Frame | 2 | 48 | 24 | Polyetheretherketone (PEEK) Glass Filled | 0.1 " | 2.54 mm | Beryllium Nickel | Nickel Boron | 0.1 in | 2.54 mm | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | Beryllium Nickel | Nickel Boron | 50 µin | 1.27 µm | 1.27 µm | 50 µin | -55 C | 250 °C |