D10650 Series
Manufacturer: Wakefield Thermal Solutions
HEAT SINK, BGA, 16.5 MM, 10.21 MM, 16.5 MM
| Part | Width [x] | Width [x] | Power Dissipation @ Temperature Rise | Length | Length | Package Cooled | Material | Attachment Method | Thermal Resistance @ Forced Air Flow | Fin Height [z] | Fin Height [z] | Type | Shape |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Wakefield Thermal Solutions | 16.51 mm | 0.65 in | 2 W 40 °C | 0.65 in | 16.51 mm | BGA | Composite | Thermal Tape Adhesive | 25 °C/W | 0.4 in | 10.16 mm | Top Mount | Pin Fins Square |
Wakefield Thermal Solutions | 16.51 mm | 0.65 in | 2 W 40 °C | 0.65 in | 16.51 mm | BGA | Composite | Thermal Tape Adhesive (Included) | 25 °C/W | 0.4 in | 10.16 mm | Top Mount | Pin Fins Square |
Wakefield Thermal Solutions | 16.51 mm | 0.65 in | 2 W 40 °C | 0.65 in | 16.51 mm | BGA | Composite | Thermal Tape Adhesive (Included) | 25 °C/W | 0.4 in | 10.16 mm | Top Mount | Pin Fins Square |
Wakefield Thermal Solutions | 16.51 mm | 0.65 in | 2 W 40 °C | 0.65 in | 16.51 mm | BGA | Composite | Thermal Tape Adhesive | 25 °C/W | 0.4 in | 10.16 mm | Top Mount | Pin Fins Square |
Wakefield Thermal Solutions | 16.51 mm | 0.65 in | 2 W 40 °C | 0.65 in | 16.51 mm | BGA | Composite | Thermal Tape Adhesive (Included) | 25 °C/W | 0.4 in | 10.16 mm | Top Mount | Pin Fins Square |
Wakefield Thermal Solutions | 16.51 mm | 0.65 in | 2 W 40 °C | 0.65 in | 16.51 mm | BGA | Composite | Thermal Tape Adhesive (Included) | 25 °C/W | 0.4 in | 10.16 mm | Top Mount | Pin Fins Square |