48-6570 Series
Manufacturer: Aries Electronics
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⌘K
CONN IC DIP SOCKET ZIF 48POS
| Part | Material Flammability Rating | Termination Post Length | Termination Post Length | Current Rating (Amps) | Number of Positions or Pins (Grid) [y] | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [x] | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Mounting Type | Contact Finish - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Pitch - Post | Pitch - Post | Contact Material - Post | Type | Type | Termination | Housing Material | Features | Contact Material - Mating | Pitch - Mating | Pitch - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | UL94 V-0 | 0.11 in | 2.78 mm | 1 A | 2 | 48 | 24 | Nickel Boron | 50 µin | 1.27 µm | Through Hole | Nickel Boron | 1.27 µm | 50 µin | 0.1 in | 2.54 mm | Beryllium Nickel | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | Solder | Polyphenylene Sulfide (PPS) Glass Filled | Closed Frame | Beryllium Nickel | 0.1 " | 2.54 mm |
Aries Electronics | UL94 V-0 | 0.11 in | 2.78 mm | 1 A | 2 | 48 | 24 | 200 µin | 5.08 µm | Through Hole | Tin | 5.08 µm | 200 µin | 0.1 in | 2.54 mm | Beryllium Copper | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | Solder | Polyphenylene Sulfide (PPS) Glass Filled | Closed Frame | Beryllium Copper | 0.1 " | 2.54 mm |