16-3513 Series

Catalog

CONN IC DIP SOCKET 16POS GOLD

Part	Termination Post Length	Termination Post Length	Current Rating (Amps)	Material Flammability Rating	Termination	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Housing Material	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Mating	Features	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Operating Temperature [Min]	Operating Temperature [Max]	Contact Material - Post [custom]	Pitch - Mating	Pitch - Mating	Contact Material - Mating	Contact Finish - Post	Pitch - Post	Pitch - Post	Mounting Type	Type	Type	Type
Aries Electronics 16-3513-11H	0.125 in	3.18 mm	3 A	UL94 V-0	Solder	2	16	8	Polyamide (PA46) Nylon 4/6 Glass Filled	0.25 µm	10 µin	Gold	Closed Frame	10 Áin	0.25 çm	-55 C	105 ░C	Brass	0.1 "	2.54 mm	Beryllium Copper	Gold	0.1 in	2.54 mm	Through Hole	7.62 mm	0.3 in	DIP
Aries Electronics 16-3513-11	0.125 in	3.18 mm	3 A	UL94 V-0	Solder	2	16	8	Polyamide (PA46) Nylon 4/6 Glass Filled	0.25 µm	10 µin	Gold	Closed Frame	10 Áin	0.25 çm	-55 C	105 ░C	Brass	0.1 "	2.54 mm	Beryllium Copper	Gold	0.1 in	2.54 mm	Through Hole	7.62 mm	0.3 in	DIP
Aries Electronics 16-3513-10	0.125 in	3.18 mm	3 A	UL94 V-0	Solder	2	16	8	Polyamide (PA46) Nylon 4/6 Glass Filled	0.25 µm	10 µin	Gold	Closed Frame	200 µin	5.08 µm	-55 C	105 ░C	Brass	0.1 "	2.54 mm	Beryllium Copper	Tin	0.1 in	2.54 mm	Through Hole	7.62 mm	0.3 in	DIP
Aries Electronics 16-3513-00	0.125 in	3.18 mm	3 A	UL94 V-0	Solder	2	16	8	Polyamide (PA46) Nylon 4/6 Glass Filled	0.25 µm	10 µin	Gold	Closed Frame	200 µin	5.08 µm	-55 C	105 ░C	Brass	0.1 "	2.54 mm	Beryllium Copper	Tin	0.1 in	2.54 mm	Through Hole	7.62 mm	0.3 in	DIP
Aries Electronics 16-3513-10H	0.125 in	3.18 mm	3 A	UL94 V-0	Solder	2	16	8	Polyamide (PA46) Nylon 4/6 Glass Filled	0.25 µm	10 µin	Gold	Closed Frame	200 µin	5.08 µm	-55 C	105 ░C	Brass	0.1 "	2.54 mm	Beryllium Copper	Tin	0.1 in	2.54 mm	Through Hole	7.62 mm	0.3 in	DIP